Gabatarwa

Daga binciken da ya gabata zuwa sabon ci gaba

Jiya mun tattauna takarda daga Jami'ar Jiangnan akan TOPCon copper plating: laser grooving yana lalata silicon, crystallinity ya ragu da maki 30 na kashi, kuma ana buƙatar annealing don gyara shi. Wannan takarda ta kammala cewa 750°C annealing + HF cleaning zai iya maido da ingancin daga 23.41% zuwa 24.85%.

Amma duk wanda ke kan layin samarwa ya san cewa 750°C annealing kanta tana da hadarin kumburin da hydrogen ke haifarwa — taga zafin jiki yana da matuƙar kunkuntar. Sama da 775°C rufin baya yana kumbura, kuma a 800°C sakamakon ya fi muni fiye da ba a yi annealing ba.

Shin akwai hanya mafi kyau?

Wani takarda na biyu da aka buga a 2026 daga Jami'ar Jiangnan + Jiangsu Xianghuan + DR Laser yana ba da sabon amsa: yi amfani da LIF (Laser-Induced Firing) don maye gurbin sintering na ƙananan zafin jiki na gargajiya, yayin da ake gyara lalacewar laser a lokaci guda.

Sakamakon: inganta ingancin +0.45% abs., ribar Voc na 0.86mV, kuma — babban ci gaba a daidaiton juriyar lamba.

1. Takaitaccen bayani: tsarin rufe tagulla na TOPCon da matsalolinsa

Tsarin daidaitaccen aiki da inda yake ciwo

Tsarin TOPCon Ni/Cu plating na yau da kullun:

Laser grooving → High-temperature annealing don gyara lalacewa → HF tsaftacewa → Ni plating → Low-temperature sintering → Cu plating

Matsaloli biyu:

• Laser grooving yana lalata silicon: kamar yadda aka tattauna a labarin da ya gabata, crystallinity ya ragu daga 99.3% zuwa 69.8%, yana buƙatar high-temperature annealing don gyarawa.

• Low-temperature sintering na gargajiya ba daidai ba ne: tanderun yana dumama dukkan tantanin halitta, gefuna suna watsa zafi da sauri yayin da tsakiya ya fi zafi, yana haifar da contact resistance ya zama babba a gefuna kuma ƙarami a tsakiya — tattara wutar lantarki mara daidaituwa yana cutar da FF.

Babban ci gaban wannan sabon takarda: shigar da LIF a cikin tsarin plating yana kashe tsuntsaye biyu da dutse daya — yana maye gurbin low-temperature sintering mara daidaituwa kuma yana taimakawa wajen gyara lalacewar laser.

2. Menene LIF, kuma ta yaya ya bambanta da sintering na gargajiya?

Dumama tanderu vs. walda mai nuni zuwa nuni

Sintering na ƙananan zafin jiki na gargajiya: sanya dukkan tantanin halitta a cikin tanderu kuma a gasa a 200–400°C. Matsalar ita ce dumama mara daidaituwa — gefuna suna yin sanyi da sauri, tsakiya yana yin zafi, kuma juriyar tuntuɓar tana bambanta sosai a fadin tantanin halitta.

LIF (Laser-Induced Firing): Laser infrared 1064nm yana bincika gaban tantanin halitta da sauri yayin da ake amfani da juyar da baya (2–18V). Laser yana tada masu ɗaukar hoto, juyar da baya yana tura su zuwa wata hanya, yana samar da daidaitaccen dumama Joule na gida a mahadar ƙarfe–silicon.

Bambanci a cikin jimla ɗaya: sintering na gargajiya shine "gasawar dukkan tantanin halitta", LIF shine "walda mai nuni zuwa nuni". LIF kawai yana dumama yankin tuntuɓar a ƙarƙashin layukan grid, yana barin komai ba tare da taɓa zafi ba.

3. Yaya LIF ke aiki akan tantanin halitta da aka yi da jan ƙarfe?

Neman madaidaicin wuri a 14V

Takardar ta fara gwajin tushe: yi amfani da LIF a mabambantan juzu'in baya akan tantanin halitta da suka gama Ni/Cu plating.

Ma'auni mafi kyau: 14V reverse bias, ingantaccen riba +0.401% abs., FF riba 1.22%, Rs raguwa 23%.

Me yasa babban ƙarfin lantarki yake sa abubuwa su yi muni?

Takardar tana amfani da Suns-Voc don auna yawan ɗigon duhu J01 da J02:

• J01 (wanda ke wakiltar sake haɗuwa pn-junction): ɗan canji da ƙarfin lantarki

• J02 (wanda ke wakiltar sake haɗuwa tsakanin ƙarfe da siliki): mafi ƙanƙanta a 14V, yana tashi a 16–18V

Fassara: yawan wutar lantarki yana nufin zafi mai yawa na Joule, kuma mahaɗin yana "walda har ya mutu". Taga yana kusa da 14V.

4. Me yasa LIF zai iya gyara lalacewar laser?

Raman spectroscopy ya bayyana sirrin

Takardar ta gudanar da gwaji mai mahimmanci: cire ƙarfen da aka ɗora kuma yi amfani da Raman spectroscopy don auna crystallinity na silicon a ƙarƙashin gridlines.

A saman gyaran zafi mai zafi, LIF yana ƙara haɓaka crystallinity.

Hanyar: LIF yana haifar da zafi mai girma na gida nan take (mafi yawan zafin gyaran al'ada) wanda ke ba da damar silicon amorphous ya sake yin crystallinity sosai, kuma yana dumama yankunan da ke ƙarƙashin gridlines kawai, yana barin layin passivation na baya ba a taɓa shi ba.

Wannan yana magance matsalar da ta rage daga labarin da ya gabata — taga zafin jiki don high-T annealing yana da kunkuntar, kuma sama da 775°C rear passivation yana kumbura. LIF shine dumama gida; rear ba ya shafa, don haka zafin jiki zai iya yin girma kuma sakamakon gyara ya fi kyau.

5. Yaushe ya kamata a yi amfani da LIF? Lokaci yana da muhimmanci

Masu neman uku da kuma wanda ya yi nasara a fili

Tsarin plating yana da matakai uku: Ni plating → low-temperature sintering → Cu plating. A ina ya kamata a saka LIF?

Takardar ta kwatanta lokuta uku:

Ƙarshe: LIF yana aiki mafi kyau idan an sanya shi a ƙarshen — bayan an gama Cu plating.

Me yasa?

Bayan plating na Cu, juriyar electrode ta ragu sosai. Lokacin da LIF ke amfani da wutar lantarki, rarraba wutar ta fi daidaito, dumama Joule ta fi daidaito, kuma haɗin gwiwa yana inganta sosai.

Idan an yi amfani da LIF kawai a kan Ni layer (kafin plating na Cu), juriya tana da yawa; wutar lantarki guda ɗaya tana haifar da dumama Joule mai yawa, wanda zai iya 'haɗa haɗin gwiwa har ya mutu' cikin sauƙi.

6. Babban bincike: LIF na iya maye gurbin sintering mai ƙarancin zafi gaba ɗaya

Tsallake tanderun gaba ɗaya

Idan LIF na iya inganta haɗin Ni–Si, to shin za mu iya tsallake matakin sintering mai ƙarancin zafi na gargajiya gaba ɗaya?

Takardar ta tsara gwaji (Group D): Ni plating → LIF (8V) → Cu plating kai tsaye, tsallake matakin sintering mai ƙarancin zafi.

Sakamako:

Daidaiton juriyar tuntuɓar rukunin D ya fi kowane rukuni da ya haɗa da sintering na gargajiya.

Me yasa?

Tanderun sintering na gargajiya suna dumama ba daidai ba — gefuna suna watsa zafi da sauri, tsakiya ya fi zafi — yana sa juriyar tuntuɓa ta fi girma a gefuna kuma ta ragu a tsakiya. LIF bincike ne na maki; kowane maki yana samun daidai adadin kuzari, daidai ta yanayi.

Ci gaba da inganta wutar LIF zuwa 6V, Rukunin D ya kai inganci na 24.74%, tare da Voc ya kai 696.72mV — +0.45% cikakken mafi girma a inganci da +0.86mV mafi girma a Voc fiye da sintering na gargajiya + babu LIF tushe.

7. Abubuwan da ke tattare da layin samarwa: an rage ƙofar samar da yawa na jan karfe?

Ci gaba guda uku na zahiri

Wannan takarda tana ba da ci gaba da yawa:

1. Ana iya gyara lalacewar Voc, kuma a gyara shi da kyau. Annealing na 750°C daga labarin da ya gabata yana da taga zafin jiki kunkuntar da haɗarin kumburi a gefen baya. LIF yana dumama gida, gefen baya yana lafiya, kuma gyaran yana da inganci.

2. An ajiye matakin tsari guda, amma dole ne a auna saka hannun jari na kayan aiki. Tsarin gargajiya: Ni plating → low-T sintering → Cu plating. Hanyar LIF: Ni plating → LIF → Cu plating. Yana ceton tanderun sintering da lokacin tsari, amma kayan aikin LIF da kansa ya fi tsada, kuma haɗin kai tare da layin plating ya fi rikitarwa. Ainihin ROI ya dogara da ƙididdigar kayan aiki.

3. Daidaiton juriyar tuntuɓar ita ce fa'idar ɓoye. Sintering na gargajiya yana nuna tazarar juriyar tuntuɓar gefe-zuwa-tsaki na 3.53Ω; hanyar LIF ta rage shi zuwa 0.45Ω. Mafi kyawun daidaito yana nufin mafi daidaitaccen tattara wutar lantarki, mafi girman FF, da ƙarancin haɗarin wuri mai zafi a matakin module.

Amma matsalolin samar da yawa sun rage:

• Zuba jari na kayan aikin LIF: yayin maye gurbin tanderun sintering, kuna ƙara laser + wutar lantarki + tsarin sarrafawa. Farashin mai siyar da kayan aiki ne ke yanke shawarar tattalin arziki.

• Rikicin haɗin layi: LIF dole ne ya haɗu da layin plating ba tare da matsala ba, kuma daidaita lokacin zagayowar (takardar tana amfani da saurin dubawa na 20 m/s) yana buƙatar tabbatarwa.

• Daidaiton sikelin GW: takardar tana matakin lab/pilot; kwanciyar hankali na yawan amfanin ƙasa a babban sikelin samarwa har yanzu yana buƙatar bayanan tallafi.

8. Kwatanta da Aiko ABC

Hanyoyi biyu, labarai biyu

Tsarin gine-ginen BC na Aiko a zahiri yana guje wa matsalar laser-grooving. TOPCon ba zai iya guje mata ba, amma LIF yana ba da mafita ta "cika rami + inganta" — ba kawai gyara lalacewa ba, har ma da ceton mataki na aiki da inganta daidaito.

9. Takaitawa

Inda abubuwa suke

Wannan sabuwar takarda daga Jami'ar Jiangnan ta tabbatar da abu daya: lalacewar laser a cikin plating na jan karfe na TOPCon ba za a iya gyara shi kawai ba, amma LIF yana gyara shi fiye da annealing na gargajiya — kuma a kan hanya yana magance matsalar daidaito na sintering mai ƙarancin zafin jiki.

Ƙaruwar inganci na +0.45% cikakke, ƙaruwar Voc na 0.86mV, da babban ci gaba a daidaiton juriyar lamba — waɗannan lambobi uku sun cancanci kimantawa mai mahimmanci akan kowane layin samarwa.

Ƙofar samar da yawa har yanzu tana nan, amma hanyar fasaha tana ƙara bayyana.

Batun tattaunawa: Shin LIF yana maye gurbin sintering low-temperature shine "bugun ƙarshe" don samar da TOPCon copper plating da yawa, ko kuwa "icing a kan cake" ne kawai?

Bayanin tunani:

• Take: Haɗa laser-induced firing tare da Ni/Cu plating don TOPCon hasken rana cell metallization

• Marubuta: Jingyun Zhang, Xi Xi, Jianbo Shao et al. (Jami'ar Jiangnan + Jiangsu Xianghuan Technology + DR Laser)

• Mujallar: Solar Energy Materials and Solar Cells

• Shekara: 2026

• DOI: 10.1016/j.solmat.2026.114198

Ra'ayin Ooitech

Ooitech ta yi imani: LIF yana mayar da gyaran lalacewar laser da daidaiton sintering zuwa mataki ɗaya, yana mai da TOPCon copper plating hanya mafi dacewa zuwa samar da azurfa mara amfani.