TOPCon Copper Plating Ya Ci Gaba: LIF Ya Maye Gurbin Sintering, Inganci +0.45% abs., Lalacewar Voc An Gyara

Gabatarwa

Daga binciken da ya gabata zuwa sabon ci gaba

Jiya mun tattauna wata takarda daga Jami'ar Jiangnan akan TOPCon copper plating: laser grooving yana lalata silicon, crystallinity ya ragu da kashi 30, kuma ana buƙatar annealing don gyara shi. Wannan takarda ta kammala cewa 750°C annealing + HF cleaning zai iya maido da ingancin daga 23.41% zuwa 24.85%.

Amma duk wanda ke kan layin samarwa ya san cewa 750°C annealing kanta tana da hadarin kumburin da hydrogen ke haifarwa — taga zafin yana da matuƙar kunkuntar. Sama da 775°C layin kariya na baya yana kumbura, kuma a 800°C sakamakon ya fi muni fiye da ba a yi annealing ba kwata-kwata.

Shin akwai hanya mafi kyau?

Wani takarda na biyu da aka buga a 2026 daga Jami'ar Jiangnan + Jiangsu Xianghuan + DR Laser yana ba da sabuwar amsa: yi amfani da LIF (Laser-Induced Firing) don maye gurbin sintering na ƙananan zafin gargajiya, yayin da ake gyara lalacewar laser a lokaci guda.

Sakamakon: inganta ingancin +0.45% abs., ribar Voc na 0.86mV, kuma — babban ci gaba a daidaiton juriyar lamba.

1. Takaitaccen bayani: tsarin jan ƙarfe na TOPCon da matsalolinsa

Tsarin daidaitaccen aiki da inda yake ciwo

Tsarin TOPCon Ni/Cu plating na yau da kullun:

Laser grooving → High-temperature annealing don gyara lalacewa → HF tsaftacewa → Ni plating → Low-temperature sintering → Cu plating

Matsaloli biyu:

• Laser grooving yana lalata silicon: kamar yadda aka tattauna a labarin da ya gabata, crystallinity ya ragu daga 99.3% zuwa 69.8%, yana buƙatar high-temperature annealing don gyarawa.

• Low-temperature sintering na gargajiya ba daidai ba ne: tanderun yana dumama dukkan tantanin halitta, gefuna suna watsa zafi da sauri yayin da tsakiya ya fi zafi, yana haifar da contact resistance ya zama babba a gefuna kuma ƙarami a tsakiya — tattara wutar lantarki mara daidaituwa yana cutar da FF.

Babban ci gaban wannan sabon takarda: shigar da LIF a cikin tsarin plating yana kashe tsuntsaye biyu da dutse daya — yana maye gurbin low-temperature sintering mara daidaituwa kuma yana taimakawa wajen gyara lalacewar laser.

2. Menene LIF, kuma ta yaya ya bambanta da sintering na gargajiya?

Dumama tanderu vs. walda mai nuni zuwa nuni

Sintering na zafin jiki na gargajiya: sanya dukkan tantanin halitta a cikin tanderu kuma a gasa a 200–400°C. Matsalar ita ce dumama mara daidaituwa — gefuna suna yin sanyi da sauri, tsakiya yana yin zafi, kuma juriyar tuntuɓar ta bambanta sosai a fadin tantanin halitta.

LIF (Laser-Induced Firing): Laser infrared 1064nm yana duban gaban tantanin halitta da sauri yayin da ake amfani da reverse bias (2–18V). Laser yana tada masu ɗaukar hoto, reverse bias yana tura su gaba, samar da dumama Joule daidai a wurin haɗin karfe–silicon.

Bambanci a cikin jimla ɗaya: sintering na gargajiya shine "gasa dukkan tantanin halitta", LIF shine "walda mai nuni zuwa nuni". LIF kawai yana dumama yankin tuntuɓar a ƙarƙashin layukan grid, yana barin komai ba tare da an taɓa shi ba.

3. Yaya LIF ke aiki akan tantanin halitta da aka yi da jan karfe?

Neman madaidaicin wuri a 14V

Takardar ta fara gwajin tushe: yi amfani da LIF a mabambantan reverse bias voltages akan tantanin halitta da aka riga aka kammala Ni/Cu plating.

Mafi kyawun sigogi: 14V reverse bias, ribar inganci +0.401% abs., ribar FF 1.22%, raguwar Rs 23%.

Me yasa babban ƙarfin lantarki yake sa abubuwa su yi muni?

Takardar tana amfani da Suns-Voc don auna yawan ɗigon duhu J01 da J02:

• J01 (yana wakiltar sake haɗuwa pn-junction): ɗan canji da ƙarfin lantarki

• J02 (yana wakiltar sake haɗuwa tsakanin ƙarfe da siliki): mafi ƙanƙanta a 14V, yana tashi a 16–18V

Fassara: yawan wutar lantarki yana nufin zafi mai yawa na Joule, kuma mahaɗin yana "walda har ya mutu". Taga yana kusa da 14V.

4. Me yasa LIF zai iya gyara lalacewar laser?

Raman spectroscopy yana bayyana sirrin

Takardar ta gudanar da gwaji mai mahimmanci: cire ƙarfen da aka yi masa plating kuma yi amfani da Raman spectroscopy don auna crystallinity na silicon a ƙarƙashin gridlines.

A saman annealing mai zafi, LIF yana ƙara haɓaka crystallinity.

Hanyar: LIF yana haifar da zafi mai tsananin lokaci (sama da yanayin zafi na annealing na gargajiya) wanda ke ba da damar amorphous silicon ta sake yin recrystallize sosai, kuma yana dumama yankunan da ke ƙarƙashin gridlines kawai, yana barin layin passivation na baya ba a taɓa shi ba.

Wannan yana magance damuwar da ta rage daga labarin da ya gabata — taga zafin jiki don high-T annealing yana da kunkuntar, kuma sama da 775°C rear passivation yana kumburi. LIF shine dumama gida; baya ba ya shafa, don haka zafin jiki zai iya yin girma kuma tasirin gyara ya fi kyau.

5. Yaushe ya kamata a yi amfani da LIF? Lokaci yana da muhimmanci

'Yan takara uku da kuma wanda ya yi nasara a fili

Tsarin plating yana da matakai uku: Ni plating → low-temperature sintering → Cu plating. A ina ya kamata a saka LIF?

Takardar ta kwatanta lokuta uku:

Ƙarshe: LIF yana aiki mafi kyau idan an sanya shi a ƙarshen — bayan an gama Cu plating.

Me yasa?

Bayan plating na Cu, juriyar lantarki ta ragu sosai. Lokacin da LIF ke amfani da wutar lantarki, rarraba wutar ta fi daidaito, dumama Joule ta fi daidaito, kuma haɗin gwiwa yana inganta sosai.

Idan an yi amfani da LIF kawai a kan Ni Layer (kafin plating na Cu), juriya tana da yawa; wutar lantarki iri ɗaya tana haifar da dumama Joule mai yawa, wanda zai iya 'kashe haɗin gwiwa' cikin sauƙi.

6. Babban bincike: LIF na iya maye gurbin sintering mai ƙarancin zafi gaba ɗaya

Tsallake tanderun gaba ɗaya

Idan LIF na iya inganta haɗin Ni–Si, to shin za mu iya tsallake matakin sintering mai ƙarancin zafi na gargajiya gaba ɗaya?

Takardar ta tsara gwaji (Group D): Ni plating → LIF (8V) → Cu plating kai tsaye, tsallake matakin sintering mai ƙarancin zafi.

Sakamako:

Daidaiton juriyar tuntuɓar rukunin D ya fi kowane rukuni da ya haɗa da sintering na gargajiya.

Me yasa?

Tanderun sintering na gargajiya suna dumama ba daidai ba — gefuna suna watsa zafi da sauri, tsakiya ya fi zafi — yana sa juriyar tuntuɓa ta fi girma a gefuna kuma ta ragu a tsakiya. LIF bincike ne na maki; kowane maki yana samun daidaitaccen kuzari, daidai ta yanayi.

Ci gaba da inganta wutar LIF zuwa 6V, Rukunin D ya kai inganci na 24.74%, tare da Voc ya kai 696.72mV — +0.45% cikakken mafi girma a inganci da +0.86mV mafi girma a Voc fiye da sintering na gargajiya + babu tushen LIF.

7. Abubuwan da ke tattare da layin samarwa: shin an rage ƙofar samar da yawa don rufin jan ƙarfe?

Ci gaba guda uku na zahiri

Wannan takarda tana ba da ci gaba da yawa:

1. Ana iya gyara lalacewar Voc, kuma a gyara shi da kyau. Annealing na 750°C daga labarin da ya gabata yana da taga zafin jiki kunkuntar da haɗarin kumburin baya. LIF yana dumama gida, baya yana tsaro, kuma gyaran yana da inganci.

2. An ajiye matakin tsari guda, amma dole ne a auna saka hannun jari na kayan aiki. Tsarin gargajiya: Ni plating → low-T sintering → Cu plating. Hanyar LIF: Ni plating → LIF → Cu plating. Yana ceton tanderun sintering da lokacin tsari, amma kayan aikin LIF da kansa ya fi tsada, kuma haɗin kai tare da layin plating ya fi rikitarwa. ROI na ainihi ya dogara da ƙididdigar kayan aiki.

3. Daidaiton juriyar tuntuɓar ita ce fa'idar ɓoye. Sintering na gargajiya yana nuna tazarar juriyar tuntuɓar gefe-zuwa-tsaki na 3.53Ω; hanyar LIF ta rage shi zuwa 0.45Ω. Kyakkyawan daidaito yana nufin tattara wutar lantarki mafi daidaituwa, FF mafi girma, da ƙananan haɗarin wuri mai zafi a matakin module.

Amma matsalolin samar da yawa sun rage:

• Saka hannun jari na kayan aikin LIF: yayin maye gurbin tanderun sintering, kana ƙara laser + wutar lantarki + tsarin sarrafawa. Farashin mai siyar da kayan aiki ne ke yanke shawarar tattalin arziki.

• Matsalolin haɗin layi: LIF dole ne ta haɗu da layin plating ba tare da matsala ba, kuma daidaita lokacin zagayowar (takardar tana amfani da saurin dubawa na 20 m/s) yana buƙatar tabbatarwa.

• Daidaiton ma'aunin GW: takardar tana matakin lab/pilot; kwanciyar hankali na yawan amfanin ƙasa a babban samarwa har yanzu yana buƙatar bayanan tallafi.

8. Kwatanta da Aiko ABC

Hanyoyi biyu, labarai biyu

Tsarin BC na Aiko a zahiri yana guje wa matsalar laser-grooving. TOPCon ba zai iya guje mata ba, amma LIF yana ba da mafita ta "cika rami + inganta" — ba wai kawai gyara lalacewa ba, har ma da ceton mataki na aiki da inganta daidaito.

9. Takaitawa

Inda abubuwa suke

Wannan sabuwar takarda daga Jami'ar Jiangnan ta tabbatar da abu ɗaya: lalacewar laser a cikin TOPCon copper plating ba za a iya gyara shi kawai ba, amma LIF yana gyara shi fiye da annealing na gargajiya — kuma a hanya tana magance matsalar daidaito na low-temperature sintering.

Ribar inganci na +0.45% abs., ribar Voc na 0.86mV, da babban ci gaba a daidaiton juriya na lamba — waɗannan lambobi uku sun cancanci kimantawa mai mahimmanci akan kowane layin samarwa.

Ƙofar samarwa da yawa har yanzu tana nan, amma taswirar fasaha tana ƙara bayyana.

Batun tattaunawa: Shin LIF yana maye gurbin low-temperature sintering shine "bugun ƙarshe" don samar da TOPCon copper plating da yawa, ko kuma kawai "icing a kan cake" na gefen lab?

Bayanin tunani:

• Title: Integration of laser-induced firing with Ni/Cu plating for TOPCon solar cell metallization

• Authors: Jingyun Zhang, Xi Xi, Jianbo Shao et al. (Jiangnan University + Jiangsu Xianghuan Technology + DR Laser)

• Journal: Solar Energy Materials and Solar Cells

• Year: 2026

• DOI: 10.1016/j.solmat.2026.114198

Ra'ayin Ooitech

Ooitech believes: LIF turns laser-damage repair and sintering uniformity into a single step, making TOPCon copper plating a meaningfully more viable route to silver-free mass production.