Me yasa zaren sel na BC na hasken rana ke karkata kamar jirgin ruwa?

Amsa mai sauri: Kirtani na sel masu tuntuɓar baya suna karkacewa kamar jirgin ruwa saboda matsar da duk ribbon zuwa baya yana sanya ƙarfe da matsiyarsa ta zafi gaba ɗaya a gefe ɗaya na sel. Lokacin da kirtanin da aka sayar ya yi sanyi, ribbon ɗin yana matsiya a kan fuskar gaba marar ƙarfe, kuma bambancin damuwa yana lanƙwasa kirtanin zuwa lanƙwasa. A kan sel na al'ada mai tuntuɓar gaba, ribbon ɗin yana rarrabuwa a kan dukkan fuskoki biyu, don haka damuwar tana sokewa da wani ɓangare. Karkacewar ba abu ne na kwalliya ba: kirtani mai lanƙwasa ba ya zama a kwance a kan gilashin a lokacin shimfiɗawa, wanda ke haifar da kauri marar daidaito na encapsulant bayan lamination kuma yana iya haifar da ƙananan tsagewa a mahaɗar inda aka matse kirtanin a kwance. Sarrafa yanayin zafi na sayarwa da saurin sanyi shine babban hanyar sarrafawa, tare da yanayin ribbon da tallafin da sel ɗin yake da shi a lokacin haɗin.

PV Module Manufacturing · na Jerry, Ooitech

Gabatarwa

Matsar da dukkan ribbons zuwa baya alama ce ta musamman na modules na BC. Yana da tsabta, yana aiki da inganci, kuma shine zaɓin da ake so ga masu amfani na gida masu daraja. Amma a bayan wannan kyakkyawan fuska, igiyar sel tana lankwasawa kamar ƙaramin jirgin ruwa.

Rashin daidaiton Tsari Da Solder na Ribbon

Dukkanin sandunan suna a baya

Ko IBC ko TBC, junction na PN na sel na BC yana a gefen baya. Kyakkyawan da mara kyau duka suna a baya. Wannan ba tsari mai daidaito ba ne. Bugu da ƙari, damuwa na raguwa daga tsarin baya mai yawa ya fi na gaba girma.

Hoto 1: Tsarin sel na BC

Solder na zafin gaske na gefe daya yana yin sauran aikin

A karkashin tsarin samar da module, har yanzu ana bukatar hada sel tare da ribbons. Solder na zafin gaske na gefe daya sai ya jawo kowace cell zuwa baka na baya, kamar yadda aka nuna a Figure 2.

Figure 2: Jerin BC cell a gaskiya

Siffa mai daidaito TOPCon tantan ba ya yin haka, kamar yadda kake gani a Hoto na 3.

Figure 3: Jerin TOPCon cell a gaskiya

Shin Wannan Aibu na Halitta Za a Iya Gyara? Shin Yana Cutar da Dogaro?

Mun gudanar da gwaje-gwaje. Sel masu kauri ba su rage lankwasawa da yawa ba. Kuma da yake rage kaurin wafer shine yanayin yanzu, idan aka kwatanta da solder na gefe biyu, wannan matsalar ba za a iya magance ta ba. Masana'antar tana kokarin inganta layukan grid na baya da amfani da solder na ƙananan zafin gaske, kuma ana daukar wannan al'amari a matsayin mai karɓuwa a cikin ma'aunin ingancin kamfani.

Akwai wata matsala kuma. A lokacin aikin lamination a ƙarshen module, wannan karkacewar da ba ta daidaita ba daga soldering na gefe ɗaya yana sa encapsulant fim ɗin da ke bayan tantan ya gudana ba daidai ba a ƙarƙashin zafi mai yawa. A wasu lokuta akwai ma haɗarin rasa fim. Amintaccen dogon lokaci ya kasance alamar tambaya.

Wataƙila ɗaya daga cikin mafita a cikin dajin fasaha na LONGi, wanda ke kashe ribbon, zai iya magance wannan a ƙarshe.

Ra'ayin Ooitech

Muna ganin wannan warping mai siffar jirgin ruwa a kan layi koyaushe, kuma da gaske yaƙi ne tsakanin ilimin cell da sarrafa tsari maimakon lahani da za ku iya goge shi. Matsalar kwararar lamination ita ce ɓangaren da ya fi damu da mu, tunda rashin daidaituwar encapsulant a gefen baya shine ainihin inda gazawar filin ke farawa shekaru da yawa bayan haka. Daga tsayin daka na layi, low-temperature stringing da ƙarin tsananin sarrafa layup sun fi muhimmanci fiye da neman wafers masu kauri. Idan kuna son ganin yadda BC da TOPCon strings suke aiki ta hanyar tabber-stringer da lamination, clips ɗin masana'antar mu a kan www.youtube.com/ooitech sun cancanci kallo.