Me yasa zaren sel na BC na hasken rana ke karkata kamar jirgin ruwa?
Teburin Abubuwan Ciki
Gabatarwa
Matsar da dukkan ribbons zuwa baya alama ce ta musamman na modules na BC. Yana da tsabta, yana aiki da inganci, kuma shine zaɓin da ake so ga masu amfani na gida masu daraja. Amma a bayan wannan kyakkyawan fuska, igiyar sel tana lankwasawa kamar ƙaramin jirgin ruwa.
Rashin daidaiton Tsari Da Solder na Ribbon
Dukkanin sandunan suna a baya
Ko IBC ko TBC, junction na PN na sel na BC yana a gefen baya. Kyakkyawan da mara kyau duka suna a baya. Wannan ba tsari mai daidaito ba ne. Bugu da ƙari, damuwa na raguwa daga tsarin baya mai yawa ya fi na gaba girma.
Hoto 1: Tsarin sel na BC
Solder na zafin gaske na gefe daya yana yin sauran aikin
A karkashin tsarin samar da module, har yanzu ana bukatar hada sel tare da ribbons. Solder na zafin gaske na gefe daya sai ya jawo kowace cell zuwa baka na baya, kamar yadda aka nuna a Figure 2.
Figure 2: Jerin BC cell a gaskiya
Cell na TOPCon mai daidaitacce ba ya yin haka, kamar yadda kake gani a Figure 3.
Figure 3: Jerin TOPCon cell a gaskiya
Shin Wannan Aibu na Halitta Za a Iya Gyara? Shin Yana Cutar da Dogaro?
Mun gudanar da gwaje-gwaje. Sel masu kauri ba su rage lankwasawa da yawa ba. Kuma da yake rage kaurin wafer shine yanayin yanzu, idan aka kwatanta da solder na gefe biyu, wannan matsalar ba za a iya magance ta ba. Masana'antar tana kokarin inganta layukan grid na baya da amfani da solder na ƙananan zafin gaske, kuma ana daukar wannan al'amari a matsayin mai karɓuwa a cikin ma'aunin ingancin kamfani.
Akwai wani abin kama. A lokacin matakin lamination a ƙarshen module, wannan warping mara daidaituwa daga soldering gefe ɗaya yana sa fim ɗin encapsulant a bayan cell ya kwarara ba daidai ba a ƙarƙashin zafi mai ƙarfi. A wasu lokuta ma akwai haɗarin rasa fim. Dogon lokaci aminci ya kasance alamar tambaya.
Wataƙila ɗaya daga cikin mafita a cikin dajin fasaha na LONGi, wanda ke kashe ribbon, zai iya magance wannan a ƙarshe.
Ra'ayin Ooitech
Muna ganin wannan warping mai siffar jirgin ruwa a kan layi koyaushe, kuma da gaske yaƙi ne tsakanin ilimin cell da sarrafa tsari maimakon lahani da za ku iya goge shi. Matsalar kwararar lamination ita ce ɓangaren da ya fi damu da mu, tunda rashin daidaituwar encapsulant a gefen baya shine ainihin inda gazawar filin ke farawa shekaru da yawa bayan haka. Daga tsayin daka na layi, low-temperature stringing da ƙarin tsananin sarrafa layup sun fi muhimmanci fiye da neman wafers masu kauri. Idan kuna son ganin yadda BC da TOPCon strings suke aiki ta hanyar tabber-stringer da lamination, clips ɗin masana'antar mu a kan www.youtube.com/ooitech sun cancanci kallo.
