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Matsalar da Ke Cikin Bugun Allon Layi Mai Kyau
  • 2026-08-08
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Matsalar da Ke Cikin Bugun Allon Layi Mai Kyau

Amsa mai sauri: Kyakkyawan bugu na allo yana kasancewa cikin yanayi na dindindin na ci gaba da ƙayyadaddun sa: takardar da ke bayanin abin da tsarin zai iya yi ta tsufa kafin a buga ta, saboda faɗin yatsun da ake samarwa suna ci gaba da raguwa. Dalilin lissafi ne. Ƙaramin yatsa yana toshe ƙarancin haske kuma yana ƙara ƙarfin da tantanin halitta ke samarwa, amma kuma yana da ƙarin juriya da ƙaramin yanki na haɗuwa, don haka tsarin manna, ragar allo da sigogin bugu duk dole ne su ci gaba tare. Girman da ake magana akai ya tashi daga kusan 13 µm zuwa 9 µm zuwa 6 µm, tare da faɗin da ake iya samu an ruwaito a cikin 16 µm zuwa 24 µm dangane da tsarin. Kowace raguwa riba ce kaɗan da ke bayyana ne kawai idan yawan samarwa ya tsaya, wanda shine dalilin da ya sa bugu mai kyau ya zama matsalar yawan samarwa kamar yadda yake matsalar ƙira.

PV Module Manufacturing · na Jerry, Ooitech

An karɓi takarda kwanan nan, amma bayanan sun riga sun tsufa. Duk wanda ke aiki a R&D ya san wannan yanayin mai ban tsoro.

Takardar Fraunhofer ISE, "Ci gaba a Buga na Gaba na Layi Mai Kyau don " TOPCon Kwayoyin Rana," misali ne na yau da kullum. Mafi tsananin ƙirarsa ta yi amfani da allon da ba shi da kulli tare da buɗe 13 µm. Duk wani abu mafi siriri ya zama marar kwanciyar hankali a cikin gwaje-gwajen. Bisa ga bayanan masana'antu da ake samu a bainar jama'a, manyan masu kera kwayoyin sun riga sun tura buɗe allon da ba shi da kulli zuwa 6 µm nan da 2026—ƙasa da rabin girman da aka ruwaito a cikin takardar.

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

Wannan bayyanar da ba ta da amfani shine ainihin dalilin da ya sa takardar ta cancanci karantawa. Ta zana iyakar iyawar aiki na bugu na allo a 2024–2025. Masana'antun da daga baya suka wuce wannan iyaka har yanzu suna aiki tare da tsarin ciniki iri ɗaya da aka bayyana a cikin binciken.

Lambobi suna ƙarewa. Hanyoyi ba sa ƙarewa. Wannan labarin yana duban abubuwa biyu: abin da takardar ta gano a lokacin, da kuma yadda samarwa da yawa daga baya ya wuce wannan iyakar da ake zato.

1. Abin da Ya Faru a cikin Takardar

Tsarin gwaji ya kasance mai sauƙi. Masu bincike sun yi amfani da ƙwayoyin hasken rana na TOPCon na nau'in M10 kuma sun raba tsarin bugu na gaba zuwa ƙungiyoyin kwatanta masu canji guda ɗaya da yawa. Waɗannan sun haɗa da allon marasa ƙulli guda uku tare da buɗe ƙididdiga na 24, 20, 17 da 13 µm, da kuma stencil na ƙarfe mai nau'i biyu na 9 µm. Tsarin baya ya kasance ba canzawa. Kawai hanyar bugu na gaba aka canza.

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

Binciken kuma ya yi amfani da sarkar tantancewa cikakke:

  • Auna nauyin manna mai ɗanɗano don ƙididdige amfani da azurfa

  • Microscopy na lantarki mai ɗaukar hoto da microscopy na confocal don auna faɗin yatsa, tsayi, yanki na tsakiya da rashin daidaituwa κ

  • Auna hanyar tsawon canja wuri don juriyar tuntuɓar

  • Gwajin I-V akan ƙananan ƙwayoyin M10 da aka kammala

Wannan tsari ya kasance hanya madaidaiciya don kimanta sabon allo, stencil, ko manna metallization.

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

Sakamakon za a iya raba shi zuwa matakai uku:

  • Buɗewar 17 µm ita ce mafi kyawun kewayon aiki. Ya samar da faɗin yatsa da aka buga na 16 µm. Idan aka kwatanta da ƙungiyar tunani ta 24 µm, ya ba da ribar inganci na 0.9% kuma ya rage yawan amfani da manna gaba da 30%.

  • Buɗewar 13 µm ta ci karo da bango. Rashin daidaituwar yatsa κ ya tashi daga 0.15 zuwa 0.24, yayin da yatsun da aka katse da sauran lahani suka ƙaru. Wannan rukunin bai ci gaba zuwa kimantawa matakin tantanin halitta ba.

  • Stencil na 9 µm ya zama misali mara kyau. An tilasta manna bugu na allo akan stencil duk da rashin daidaituwar danko. Sakamakon yatsa da aka buga ya kasance 19 µm faɗi—fiɗa fiye da yatsan da ƙungiyar buɗe allo ta 13 µm ta samar.

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

Ma'anar ta bayyana a sarari. Ga bugu na allo marar ƙulli, kewayon layi mai kyau na aiki ya kasance kusan buɗewar 15–17 µm. Ƙasa da wannan batu, ingancin bugu ya rushe da farko.

Tazarar lokaci tsakanin takardar da samarwa na 2026: kwatance guda huɗu

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

1. Iyakar bugawa

A cikin takardar, buɗewar 13 µm ta riga ta kasance marar kwanciyar hankali. Rashin daidaituwa κ ya tashi zuwa 0.24, lahani ya ƙaru kuma ƙungiyar ba ta taɓa kaiwa ga kimantawar tantanin ba. Dangane da bayanan masana'antu da aka bayar a fili, manyan layukan samarwa sun koma zuwa buɗewar allo marar ƙulli na 6 µm nan da 2026.

Iyakar iyawar da takardar ta zana an tura ta gaba sosai. Abin da ake kira iyaka ba katanga ce ta dindindin ba. Shi ne ma'aunin daidaito tsakanin manna, allo, da kayan bugawa da ke akwai a lokacin.

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

2. Dalilin adana manna

Mafi kyawun ƙungiya a cikin takardar—buɗewar 17 µm da yatsa da aka buga na 16 µm—ta sami ingantaccen inganci na 0.9% yayin da ta rage yawan amfani da manna na gaba da 30%.

Nan da 2026, yawan amfani da azurfa ya zama mafi girman abin kashewa wanda ba silicon ba a yawancin tsarin farashin samar da tantanin. Adana manna ba ya zama manufar ingantawa ta biyu ba. Ya zama al'amarin gasa a samarwa, kuma a wasu lokuta, rayuwa. Hanyar takardar ta canza daga kayan aikin inganci zuwa kayan aikin sarrafa farashi.

3. Hanyar stencil

Foil ɗin ƙarfe na takardar mai nauyin 9 µm bai yi nasara ba saboda ɗanko na paste ɗin bai dace da hanyar bugawa ba. Ya samar da yatsa mai faɗin 19 µm.

A shekara ta 2026, buga farantin ƙarfe bisa ga stencil ɗin ƙarfe mai cikakken buɗewa ya shiga samarwa da yawa. Hanyar da ta gaza a cikin takardar daga baya ta zama muhimmiyar jagorar masana'antu. Darasin a bayyane yake: canza hanyar bugawa kuma yana buƙatar canza paste ɗin.

4. Ƙimar ribar inganci

Takardar ta ba da rahoton ribar inganci na 0.9%. A shekara ta 2026, ingancin sel ya shiga kewayon 26%+, tare da sakamakon da aka ruwaito tsakanin 26.09% da 26.66% a cikin misalan da aka tattauna a nan.

Ƙimar gefe na rage inuwa har yanzu tana nan, amma babban abin da ke motsa kasuwanci ya koma daga inganta inganci zuwa rage amfani da azurfa.

Matsalar A cikin Fine-Line Screen Printing Tana Boye A cikin Paste

2. Daga 13 µm zuwa 6 µm: Yadda aka Karya Iyaka

Shin 13 µm da gaske iyakar jiki ce ta buga allo?

A'a. Takardar kanta ta bar alamomi da yawa.

A cikin ƙirar allo guda uku, diamita na waya ya ragu daga 11 µm zuwa 9 µm sannan zuwa 5 µm. Yawan buɗe wuri ya ƙaru daga 0.6 zuwa 0.7 sannan 0.8. An kuma gabatar da daidaitawar raga na 0°.

A takaice, sakamakon 13 µm bai nufi cewa ba za a iya yin allon mafi kyau ba. Yana nufin cewa haɗin manna, allo da kayan aiki da ake da su a lokacin ba za su iya tsayawa tsayin daka a wannan matakin ba.

Wanne gefen wannan triangle ne ainihin matsalar?

Allon da kansa za a iya ware shi. Binciken ya wakilci fasahar allo marar ƙulli ta zamani a lokacin. Girman waya, yanki na buɗe ido da kusurwar allo an riga an tura su sosai. Ƙungiyar 13 µm ba ta gaza ba saboda mai ba da allo bai yi ƙoƙari ba. Allon yana riƙe da manna.

Kayan bugu kuma sun dogara ne akan dandamalin masana'antu na gaba ɗaya. Ana samun irin waɗannan na'urori a dakin gwaje-gwaje da manyan layukan samarwa. Wannan ya bar manna a matsayin mabuɗin canji.

Bugu mai laushi shine gwagwarmaya ta uku. Kowane raguwar 1 µm a faɗin yatsa yana rage inuwa na gani, amma kuma yana rage yankin yatsa. Matsalolin jeri na iya tashi, yayin da haɗarin lahani na bugu da asarar yawan aiki ke ƙaruwa. Sakamakon ya dogara ne akan ko manna, allo da tsari za su iya ci gaba tare.

Tsakanin 2024 zuwa 2026, dukkan bangarori uku sun ci gaba.

Manna: daga haɗin gaba ɗaya zuwa kayan ƙirar ƙira

Girman barbashin azurfa ya ci gaba da raguwa, yayin da manna na layi mai kyau ya zama nau'in samfur na daban. Ci gaban manna na gaban TOPCon ya tafi ta hanyoyi uku: buga yatsu masu kunkuntar, kiyaye halayen konewa mai kyau da kuma guje wa karuwar juriyar wutar lantarki.

Tare da buɗewar allo na 6 µm, barbashin da suka ɗan fi girma kaɗan na iya toshe allon. Kiyaye siffar yatsa mai daidaito ya zama mafi wahala.

Rashin daidaiton yatsu mai kyau κ, a tushensa, nuni ne na rheology na manna a ƙarƙashin buɗeɗe masu matuƙar kunkuntar. Idan manna ba zai iya canjawa cikin daidaito ta buɗewar 6 µm ba, sakamakon shine toshewar allo, yatsu da aka katse da kuma karuwa mai ƙarfi a κ. Rukunin 13 µm a cikin takardar ya bayyana ya gaza saboda ingancin bugu. A mataki mai zurfi, manna ya kai iyakarsa na canjawa a ƙarƙashin wannan buɗewar.

Dangantaka ta kusa tsakanin tsarin manna da hanyar bugu an nuna ta akai-akai a cikin shekaru biyu da suka gabata.

Allo: tsarin marasa ƙulli da kuma daidaitawar 0° sun zama daidaitattun

Allon 500-05 na takardar—tare da diamita na waya 5 µm, rabon buɗe 0.8 da daidaitawar 0°—ya kasance ƙira mai ƙarfi a lokacin.

Manyan samarwa na allo daga baya sun koma wani tsara a cikin wannan hanya. Diamita na waya ya zama mafi ƙanƙanta, rabon buɗaɗɗen fili ya ƙaru kuma sarrafa tashin hankali ya inganta. Samarwa mai ƙarfi tare da buɗaɗɗen 6 µm da farko yana buƙatar ƙwararrun ƙwarewar masana'antu a cikin allon kansa.

Tsari: LECO sarrafa ƙaramin-finger tuntuɓar juriya

Wannan gefen ne wanda sau da yawa ana watsi da shi.

Yayin da yatsu suka zama ƙanƙanta, wurin tuntuɓar yana raguwa. Juriya na tuntuɓar yawanci zai tashi sosai. LECO, ko inganta tuntuɓar da aka haɓaka ta laser, ya zama sananne sosai tare da samar da TOPCon mai ƙaramin layi saboda yana iya rage wannan asarar lantarki.

Rahotannin masana'antu sun nuna cewa an riga an yi amfani da LECO a cikin babban rabo na ƙarfin TOPCon. Ya canza daga haɓakar inganci na zaɓi zuwa tsari mai amfani don samar da ƙaramin-finger. Ba tare da LECO ko wata hanya ta daidaita tuntuɓar ba, buga cikin nasara ta hanyar buɗaɗɗen 6 µm ba lallai ba ne tsarin ya kasance a shirye don samarwa mai ƙarfi.

Da zarar manna, allo da tsari duk sun ci gaba, ma'aunin ya koma daga kusan 15 µm zuwa kewayon 6–8 µm. Ba a karya iyaka ta wani babban ƙirƙira ba. Ƙarfi uku sun tura shi a lokaci guda.

3. Hanyar da Takardar Ta Bari

Idan akwai abu daya kacal da za a dauka daga wannan takarda, ya kamata ya zama tsarin maimakon lambobin.

Na farko: ciniki mai bangare uku

Kowane tsarin bugu mai lafiya shine ma'auni tsakanin inuwa na gani, juriya na lantarki da ingancin bugu. Wannan tsarin yana nan har ma yayin da girman fasalin ke ƙaruwa. Ana iya amfani da wannan dabaru don kimanta bugu na farantin karfe, fuska na electroformed da sauran hanyoyin metallization.

Na biyu: sarkar siffantawa

Auna manna, duba siffar, auna juriya na tuntuɓar sannan a gwada tantanin da aka kammala. Da zarar waɗannan matakai guda hudu sun cika, ana iya ƙididdige darajar sabon fuska ko manna.

Me ya sa rukunin 13 µm bai ci gaba zuwa kimantawar tantanin ba? Domin siffantawar geometric ta riga ta bayyana matsalar ta hanyar haɓakar κ mai kaifi. Tsarin—duba siffar farko, auna aikin lantarki na biyu sannan a kimanta tantanin a ƙarshe—yana taimakawa hana lambar inganci guda ɗaya ɓoye tsari mai rauni ko mara karko.

Na uku: manna da hanyar bugu dole ne su canza tare

Stencil na 9 µm ya gaza saboda an tilasta wa manna bugu na allo a kan tsarin stencil. Masana'antun da ke gabatar da bugu na farantin karfe yanzu suna daidaita ko sake haɓaka tsarin manna su. Takardar ta riga ta yi alama ga wannan tarko ta hanyar ƙungiyar gwaji guda ɗaya da ba ta yi nasara ba.

Na huɗu: ya kamata a ƙidaya yawan yatsu, ba a zato ba

Takardar ta yi amfani da bayanan juriya da aka auna a baya don ƙididdige mafi kyawun adadin yatsu masu laushi, bin irin tunanin da kayan aiki kamar Gridmaster da Pitchmaster ke amfani da su.

Yin ƙaura daga ƙirar grid bisa gwaninta zuwa ƙirar grid da aka ƙididdige yana da ƙima sosai a zamanin layi mai laushi. Ƙuntata yatsu ba tare da sake ƙididdige pitch, yawan yatsu da juriya ba na iya kawai motsa asara daga shading zuwa juriya na jerin.

4. Sabon Fagen Yaƙi da Takardar Ba Ta Rufe Ba

Takardar ta tsaya a bugu na allo da stencil na foil na ƙarfe. Duk da haka, nan da 2026, fagen yaƙi na layi mai laushi bai iyakance ga bugu na allo na al'ada ba. Ƙarfin tarko da iyakokin tsari suna sa samarwa mai ƙarfi a ƙasa da 10 µm ya zama da wahala, don haka masana'antar ta kasance tana bincika wasu hanyoyi da yawa.

  • Bugu na farantin karfe: Cikakken buɗaɗɗen ƙarfe stencil zai iya samar da yatsa 14–15 µm. A cikin misalin da aka tattauna a nan, girman rabo ya ƙaru daga 45% zuwa 59%, yayin da juriyar tuntuɓar ta faɗi da 15%. Binciken da aka buga a Joule ta Cibiyar Nazarin Kayan Aiki da Injiniya ta Ningbo ta ba da rahoton ci gaba a wannan hanya, kuma an ruwaito Tongwei a matsayin kamfani na farko da ya gabatar da tsarin a cikin samarwa mai yawa a duniya. A zahiri, bugu na farantin ƙarfe ya mayar da ra'ayin stencil da ya gaza a cikin takardar zuwa hanyar samarwa ta hanyar magance matsalar daidaita manna.

  • Ƙarfe na lantarki (electroformed screens): Dangane da rahotannin masana'antu da iƙirarin masana'anta, daidaiton tsarin yatsa na iya kaiwa ±2 µm. An ba da rahoton ƙwayoyin TOPCon da ke amfani da ƙarfe na lantarki a ingancin 26.2%. Waɗannan alkaluma ya kamata a har yanzu a tantance su bisa yawan samarwa, yanayin aunawa, da kwanciyar hankali na tsari na dogon lokaci.

  • Layukan R&D sun kai yatsa 10 µm: Haɗin gwiwar Cibiyar Nazarin Kayan Aiki da Injiniya ta Ningbo da JinkoSolar sun rage faɗin yatsa zuwa 10 µm da tazarar daga 1,120 µm zuwa 825 µm. Ƙwayar M10 ta masana'antu ta sami ingancin da aka tabbatar na 26.66% a cikin sakamakon da aka ruwaito.

Takardar kuma ba ta mayar da hankali kan ƙimar cikakkiyar amfani da azurfa ba. Buga layi mai kyau ya samar da raguwar manna na 30%, amma nan da 2026 babban rikici shi ne cikakkiyar amfani a kowace tantanin halitta.

Ga tantanin halitta na 210R, matsakaicin amfani da manna azurfa a masana'antu ya shiga kewayon 70+ mg a kowace tantanin halitta bisa ga alkaluman masana'antu da aka tattauna a nan. Azurfa ta zama mafi girman abin kashe kuɗi ba silicon ba. Rage manna ya canza daga manufar ingantawa zuwa fifikon samarwa.

Buga layi mai kyau hanya ɗaya ce kawai. Manna jan ƙarfe mai rufe azurfa, electroplating na jan ƙarfe da sauran hanyoyin rage azurfa ko rashin azurfa suna ci gaba a lokaci guda.

5. Yadda Injiniyoyin Layin Samarwa Ya Kamata Su Karanta Wannan Takarda

Ayyuka uku masu amfani suna da muhimmanci.

Na farko: mayar da hankali kan tsarin, ba tsoffin lambobi ba

Rikodin samarwa sun riga sun wuce iyakokin lambobi na takardar. Tsarin ciniki uku, sarkar siffantawa da dabaru na haɗin manna-tsari har yanzu suna da amfani. Suna ba da samfurin aiki don kimanta kowane sabon allo, manna ko tsarin metallization akan ainihin layin samarwa.

Na biyu: lissafta ma'aunin naka

Gaskiyar cewa babban masana'anta na iya gudanar da buɗewar 6 µm ba yana nufin kowane layi ya kamata ya ɗauke shi nan da nan ba.

Tsarin manna naka, mai ba da allo, yanayin bugu, tsarin LECO, taga tanderu da yawan amfanin ƙasa suna tantance inda ainihin ma'aunin ka yake. Bin ƙaramin buɗewa da ake samu ba tare da tabbatar da waɗannan abubuwan ba na iya sake haifar da gazawar 13 µm na takarda: ƙarar κ, yatsun da aka katse da kuma ƙaruwar lahani kwatsam.

Na uku: raba rage azurfa zuwa matsalolin injiniya

Azurfa babban abu ne mai tsada wanda ba silicon ba. Bugun layi mai kyau, inganta manna, haɓaka allo, azurfa mai rufe jan ƙarfe da rufe jan ƙarfe kowanne yana da nasa ma'auni tsakanin inganci, juriya, kwanciyar hankali na tsari, saka hannun jari na kayan aiki da yawan amfanin ƙasa.

Takardar ba ta ba da amsa ɗaya ta ƙarshe ba. Tana ba da kayan aiki don raba matsalar zuwa sassa masu aunawa.

Takaitawa

Buɗewar 13 µm an taɓa ɗauka a matsayin iyakar bugun allo marar ƙulli. Bisa ga bayanan masana'antu da ke akwai a bainar jama'a, an tura wannan iyaka zuwa 6 µm nan da 2026.

Iyaka ba ta taɓa zama bango ba. Ita ce mahadar iyawar kayan aiki, daidaiton na'ura da sarrafa tsari a wani lokaci na musamman. Paste na ɗaya daga cikin mafi ƙarancin kima a wannan mahadar. Shi ne ya haifar da ƙungiyoyin da suka gaza a cikin takardar, kuma daga baya ya zama ɗaya daga cikin abubuwan da ke tantance samarwa da yawa.

Mahadar za ta ci gaba da motsi. Tsarin ba zai canza ba. Wannan shine darajar da ta dawwama a cikin wannan takarda.

Zaɓe: Wane matakin siririn yatsa na gaba ne layin samarwarku ya kai?

Wace hanya ce kuke amfani da ita don rage azurfa a yanzu: siririn yatsa, azurfa mai rufin jan ƙarfe ko jan ƙarfe ta hanyar lantarki?

#TOPCon #ScreenPrinting #FineLinePrinting #SilverPaste #LECO #SteelPlatePrinting

Ra'ayin Ooitech

Babban burin samarwa ba shine mafi ƙaramin buɗewar allo ba; shine mafi ƙarancin amfani da azurfa da za a iya kiyayewa ba tare da sadaukar da juriyar tuntuɓar, yawan amfanin ƙasa ko lokacin aiki ba. Tsarin 6 µm yana haifar da ƙima ne kawai lokacin da paste rheology, tashin hankalin allo, sigogin bugawa, taga harbawa da saitunan LECO suka cancanta a matsayin tsari ɗaya. Ga injiniyoyin layi, κ, ƙimar katsewa da rarraba juriya yawanci suna da amfani fiye da sakamakon ingancin cell guda ɗaya mafi kyau.


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Nemi Farashi

Duk abubuwan da aka ɗora suna da tsaro kuma sirri ne.

Me ya sa Zaɓe Mu

Muna isar da gwanintar da za ka iya amincewa sabis ɗinmu

Kayan aiki kai tsaye daga masana'anta.

Fa'idodin Rage Kuɗi

Muna ba da ƙima ta musamman, muna haɓaka sakamako yayin da muke rage kasafin kuɗi ga abokan ciniki.

Ƙungiyar Ƙwarewarmu

Kwararrun ma'aikatanmu sun ƙware a sababbin hanyoyin magance matsaloli da dabarun da aka keɓance.

Fiye da Shekaru 15 na Ƙwarewar Masana'antu

Ƙwarewa mai zurfi tana tabbatar da sakamako masu dogaro, masu bin zamani, da tabbatattu don nasara.

Shaidun Abokan Ciniki

Abin da Abokin Cinikinmu Ya ce game da mu

Shaidun abokan ciniki sun yaba da zurfin fahimtarmu game da ƙalubalen su, wanda ke haifar da sababbin hanyoyin magance matsaloli da riba mai ƙarfi. Haɗin gwiwa na dogon lokaci—wasu fiye da shekaru goma—suna nuna amincewarsu da gamsuwa. Labaran nasarar su suna motsa mu don ci gaba da wuce tsammanin su. Ƙara Sani

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