Buga Farantin Karfe + Yatsan Poly-Silicon na Gida: Matsayin Gaba na TOPCon Ya riga Ya Faru
Teburin Abubuwan Ciki
Gabatarwar Samfur
Watan da ya gabata na ziyarci wata masana'anta ta TOPCon. Old Zhang, wanda ke jagorantar tsarin aiki, yana goge hannuwansa bayan ya canza sabon allo daga na'urar bugu, yana lissafin da ni da murya.
"Wani allo na waya karfe na PI-film yana kashe 4,000 zuwa 8,000 yuan, kuma a fadin masana'antar, tsawon rayuwa yawanci kusan 400,000 wafers. Mai kyau ya kai 450,000, mara kyau yana zubar da man a 300,000. Idan aka raba kan kowane wafer, wannan ya zama centi ko biyu. Kana tunanin na damu da kudin allo?"
Ya jingina da akwatin kayan aiki kusa da na'urar bugu, ya rage muryarsa: "Man azurfa shine ainihin labarin."
Farkon 2023, azurfa tana kusan Naira 6,000 a kowace kilogiram, kuma man azurfa ya kasance kawai 3.4% na farashin module. Zuwa wannan watan Janairu, man ya haura zuwa 29% na jimlar farashin module. Man azurfa a hukumance ya wuce polysilicon a matsayin babban abin da ke haifar da farashi a cikin module na PV.
A ranar 23 ga Yuni, azurfa na spot ya kasance 15,233 yuan/kg, kuma man azurfa na gaba mai kyau ya yi farashin 15,779 yuan/kg.
"Kashi 29 cikin dari!" Ya buga ƙofar kabinet. "Muna ƙoƙari sosai wajen rage farashi da inganta aiki, amma har yanzu bai kai kwana ɗaya na canjin farashin azurfa ba."
Ya fitar da wayarsa ya nuna mini wani jadawali na ciki: farashin man azurfa na gaba a cikin shekaru uku da suka gabata, kusan hawan digiri 45 madaidaici.
"Ka ga waccan takardar buga farantin karfe?" Na tambaya.
"Na karanta ta. Wannan na Joule daga Cibiyar Kayan Aiki ta Ningbo. Duk rukunin layin samarwa sun watsa ta. Amma gudanarwa har yanzu tana shakka, domin a ƙarshe, shin wannan abu zai iya adana kuɗi da gaske?"
Yayin da yake fadin haka, wani bugu na allo a kusa yana fitar da rukuni na gaba, squeegee yana zamewa azurfa a kan allo a tsayayyen yanayi, sautin vacuum yana kiyaye kari.
Ya buga a tsaye. Tsayayye, amintacce, babban samfur, ma'aikatan da suka san shi sosai.
Amma kowa ya san cewa "tsayayye" bai taba zama kariya a wannan sana'ar ba.
Wannan labarin yana amsa tambaya daya: shin bugu na farantin karfe tare da poly-silicon na gida zai iya taimaka wa TOPCon don dawo da wasu fa'idodin farashi a 2026, tare da farashin azurfa mai girma haka?
A watan Janairu 2026, Joule ya buga aikin kungiyar Ye Jichun a Cibiyar Kayan Aiki ta Ningbo, CAS. A kan wafers na masana'antu M10, sun yi amfani da bugu na farantin karfe don maye gurbin bugu na allo na al'ada don grid na gaba, da poly-silicon na gida don maye gurbin poly na cikakken yanki don tuntuɓar baya. Ingantattun da ISFH ta tabbatar: 26.09%.
Wannan lambar ba ita ce rikodin masana'antu ba. JinkoSolar ya buga 26.4% a watan Yuni 2026, kuma Trina yana da 26.58% takardar shaida a baya. Amma darajar nan ba ita ce adadin inganci ba, ita ce wannan takarda ta magance matsalolin TOPCon guda uku a lokaci guda: inganci, rage amfani da azurfa, da kuma bifaciality. Kuma duka fasahohin biyu sun dace da layukan da ake da su, ba rushewa da sake ginawa ba.
Bari mu bude shi.
Ma'aunin Fasaha
Siffar Layin Grid: Bugawar allo vs Bugawar farantin karfe
| Ma'auni | Bugawar allo | Bugawar farantin karfe |
|---|---|---|
| Nisa layin | 17.0-19.4 μm | 14.1-15.5 μm |
| Tsayin layin | 8.7 μm | 8.9 μm |
| Matsakaicin girma | 45.1% | 58.9% |
| Siffar gefen | Karkatacce | Kusan tsaye |
| Tazarar yatsa | 1066 μm | 944 μm |
| Ƙarfin tuntuɓar | mafi girma | 2.4 mΩ·cm² (~15% ƙasa) |
Local Poly-Silicon vs Full-Area Poly (30% coverage)
| Ma'auni | Full-Area Poly | Local Poly-Silicon |
|---|---|---|
| Jsc | 41.90 mA/cm² | 42.09 mA/cm² |
| J0 (saturation current density) | 8.76 fA/cm² | 6.40 fA/cm² (-27%) |
| Bifaciality | 84.26% | ~90% |
| Voc | 724.9 mV | 729.9 mV |
| Inganci | ~25.8% | 26.09% |
| LCOE reduction | baseline | -1.7% |
Fa'idodin Fasaha
One: Steel Plate Printing Is More Than Swapping a Screen
Conventional TOPCon front grids use screen printing, where a woven mesh scrapes silver paste onto the wafer. That woven mesh has knots where warp and weft cross, and paste transfers through the gaps between them. Those knots dictate the grid shape: wide, short, sloped edges.
Steel plate printing yana amfani da stencil na ƙarfe mai cikakken buɗewa, irin wannan fasaha da Tongwei ke kira "bugu na farantin ƙarfe mai cikakken buɗewa." Babu saƙa. Manna yana fitowa kai tsaye ta cikin buɗeɗɗen da laser ko electroforming suka buɗe. Siffar grid tana canzawa nan take:
Bugu na allo: 17.0-19.4 μm faɗi, 8.7 μm tsayi, girman rabo 45.1%, gefuna masu gangara.
Bugu na farantin ƙarfe: 14.1-15.5 μm faɗi, 8.9 μm tsayi, girman rabo 58.9%, gefuna kusan a tsaye.
3-4 μm ƙarami, 0.2 μm tsayi, girman rabo daga 45% har zuwa 59%.
Canje-canje uku, asusu uku don daidaitawa:
Na farko, ƙarancin inuwa. Ƙananan yatsu, ƙarin buɗe wuri don haske. Wannan 0.1% cikakken ribar inganci ya fito daga waɗannan 3-4 microns.
Na biyu, ƙarancin azurfa. Ɗauki 210R cell. Bayanan filin na Yuni 2026 sun nuna manyan masu yin TOPCon sun riga sun kai 78.5-85.5 mg/wafer, matsakaicin masana'antu kusan 83 mg/wafer. Tare da allon karfe, babban amfani a yanzu shi ne a kan rear busbar/finger, yanke 3-5 mg a kowace wafer.
3-5 mg yana da kadan, amma idan ka ninka shi da yawan layin, yana ƙaruwa. A farashin paste na yanzu na kusan 15,779 yuan/kg, ceton 3-5 mg a kowace wafer yana kusan 0.047-0.079 yuan/wafer. Layin da ke gudanar da wafers 500,000 a rana yana ceton 23,500-39,500 yuan a rana, ko miliyan 7 zuwa 12 yuan a shekara (fiye da kwanaki 300).
Kuma wannan shine kawai raguwar finger na baya. Yayin da tsarin ke girma, bugu na karfe yana motsawa zuwa busbar na gaba da kuma grid mai kyau, tare da ƙarin ceton azurfa a gaba.
Na uku, yana sa hanyar emitter mai juriya mai girma ta yi aiki. Yatsun ƙarfe na iya matsewa sosai. A cikin takardar, tazarar ta ragu daga 1066 μm zuwa 944 μm. Yatsu masu yawa suna nufin gajeren tafiyar mai ɗaukar kaya, don haka juriya ga ƙarfin emitter sheet ya ƙaru. Ƙididdigar takardar ta nuna cewa yayin da ƙarfin emitter sheet ya haura daga 300 zuwa 600 Ω/sq, fa'idar farantin ƙarfe tana faɗaɗa daga 0.09% zuwa 0.12%.
Wannan lamari ne na littafi game da tsarin da ke canza taga aikin: buga farantin ƙarfe ba kawai musanya firinta ba ne, yana buɗe sabon filin ƙirar emitter.
Game da farashi da rayuwar stencil farantin ƙarfe da kansa, ga lissafin da layin ya fi damuwa da shi:
Al'ada PI-film ƙarfe-waya allo: 4,000-8,000 yuan kowanne, rayuwa kusan 400,000 wafers.
Stencil farantin ƙarfe (matakin ƙaddamarwa na yanzu): farashin raka'a fiye da 50% mai rahusa fiye da PI-film (kewayon 2,000-4,000 yuan), amma rayuwa kusan 200,000 wafers a yanzu. Mai kyau ya kai 200,000, mara kyau ana maye gurbinsa a 150,000.
Amortization na allo: PI-film kusan 0.01-0.02 yuan/wafer, farantin karfe kusan 0.01-0.02 yuan/wafer. Suna karya daidai. Amfanin farantin karfe ba a cikin allo ba, yana cikin tanadin azurfa: 3-5 mg a kowace wafer a kan yatsa na baya, kusan 0.047-0.079 yuan/wafer, wanda ya fi girma fiye da gibin amortization.
Amma rayuwar farantin karfe rabin na PI-film ne, ma'ana sau biyu na yawan canji, sau biyu na lokacin dakatarwa, sau biyu na aiki. Ko tanadin azurfa ya rufe farashin ɓoye na canji mai yawa ya dogara da yadda layin ku ke cika. Ga manyan 'yan wasa masu cikakken aiki, lissafin yana aiki. Ga layukan da ba a yi amfani da su sosai ba, farantin karfe bazai biya ba. Wannan shine dalilin da ya sa Tongwei da Jietai, waɗanda ke da ƙarfin sha na cikin gida, suka yi ƙarfin zuwa gaba. Girma yana rage raunin gajeren rayuwa.
Na biyu: Tuntuɓar Azurfa-Silicon, Ƙarin 0.4% Fill Factor da Buga Farantin Karfe ke Bayarwa
Ƙananan yatsu suna bayyana ƙarancin inuwa da ƙarancin azurfa. Amma buga farantin karfe yana ba da ƙarin riba: ƙarancin tuntuɓar ya ragu kusan 15%. Auna a cikin takardar: 2.4 mΩ·cm², fiye da buga allo, kai tsaye darajar 0.4% cika factor (FF) riba.
Me yasa musanya allo ke inganta tuntuɓar?
Takardar ta gudanar da cikakken nazarin siffar. Bayan an cire grid na azurfa da nitric da hydrofluoric acid, sun duba ƙwayoyin azurfa da suka rage a saman silicon. Samfuran farantin karfe suna da babban yawan ƙwayoyin da aka lura, girman 20-40 nm, sun fi bazuwa daidai. TEM ya kara nuna samfuran farantin karfe sun kafa tsari mai yawa, ci gaba da hanyar sadarwa na azurfa a cikin gilashin a mahadar azurfa-silicon.
Waɗannan ƙwayoyin azurfa sune hanyar wutar lantarki. Electrons ba sa buƙatar ketare gilashin mai juriya; suna tsalle kai tsaye tsakanin ƙwayoyin azurfa.
Mafi kyawun shaida ya fito daga scanning spreading resistance microscopy (SSRM). Wannan dabara a zahiri tana "ganin" rarraba juriya: duban yanki daga silicon zuwa azurfa grid, yankuna masu juriya mai girma suna haske, yankuna masu juriya mara ƙarfi suna duhu. Yankin canjin mu'amala na samfurin farantin karfe shine mafi ƙunci kuma mafi duhu, don haka juriyar mu'amala da gaske ta ragu.
Hanyar bugawa → rarraba barbashin azurfa → juriyar mu'amala → abubuwan cika. Kowane mataki na wannan sarkar dalili yana da goyon bayan bayanai.
LECO (Laser Enhanced Contact Optimization) ya riga ya zama ma'aunin masana'antu, ana sa ran zai rufe kusan 600 GW na ƙarfin TOPCon. Amma ko da tare da irin wannan maganin LECO, bugun farantin karfe har yanzu ya rage juriyar tuntuɓar da wani 15% fiye da bugun allo. Wannan yana nufin bugun farantin karfe yana da asalin ingancin mu'amala wanda LECO ba zai iya daidaita shi ba.
Uku: Poly-Silicon na Gida, Cire Abin da Bai Kamata Ya Kasance a Nan (Fasahar Rear Poly-Finger)
Cikakken yanki poly-silicon a bayan TOPCon takobi ne mai kaifi biyu.
Kyakkyawan gefen: ingancin passivation na musamman, ɗayan mafi balagaggun tsarin sadarwa na passivated-contact a kusa.
Mummunan gefen: poly yana sha haske. Sha'awarsa na parasitic a cikin infrared na kusa yana cinye hasken da ya kamata ya zama wutar lantarki. Sakamakon kai tsaye: gajeren kewayawa (Jsc) ba zai iya tashi ba, bifaciality ba zai iya hawa ba. TOPCon bifaciality yawanci yana zaune a 80%-85%, yayin da heterojunction ya kai 90%-95%.
Tunanin takardar a bayyane: kiyaye poly kawai inda electrode ke buƙatar sadarwa, maye gurbin sauran da AlOx/SiNx.
Hanyar ita ce laser da kuma wet etching:
Ajiye poly-silicon na cikakken yanki (150 nm)
532 nm picosecond laser yana tsara wuraren da za a cire
Laser yana canza gilashin phosphosilicate na gida (PSG)
KOH alkaline solution yana zaɓar cire poly a cikin yankunan da aka haskaka
Kimanin 30% na yankin yana kiyaye poly a matsayin wuraren tuntuɓar
SEM na sashin giciye a cikin takardar yana da tsabta: gefen poly yana nuna 2.7 μm mataki, fuskar tsaye da ta rage bayan an cire poly gaba ɗaya, ba tare da wani lahani na laser da ake iya gani ba. Wannan yana nufin daidaiton zaɓin-etch ya isa.
To menene ya faru idan ɗaukar hoto ya ragu daga 100% zuwa 30%?
Jsc ya tashi daga 41.90 zuwa 42.09 mA/cm², sama da 0.19 mA/cm². Ƙarancin sha na poly, ƙarin haske ya zama wutar lantarki.
J0 (saturation current density) ya faɗi daga 8.76 zuwa 6.40 fA/cm², ƙasa da 27%. Ƙarancin wurin tuntuɓar yana da kyau a zahiri, saboda AlOx/SiNx passivation ya isa shi kaɗai, don haka maye gurbin yankunan poly yana rage yawan cibiyoyin sake haɗuwa.
Bifaciality ya haura daga 84.26% zuwa kusan 90%. Tare da 70% ƙarancin poly a baya, samar da baya yana ƙaruwa. Daga 84% zuwa 90% yana nufin aƙalla ƙarin maki 5 na ribar samar da baya a cikin yanayin haske mai ƙarfi kamar dusar ƙanƙara, yashi, da ruwa.
Voc ya tashi daga 724.9 mV zuwa 729.9 mV. Ƙarancin sake haɗuwa a yankunan poly, ƙarfin lantarki yana ƙaruwa.
Inganci: cikakken yanki poly tunani kusan 25.8%, poly na gida ya kai 26.09%, kusan 0.3% cikakken riba.
Haɗe tare, takardar ta sanya raguwar LCOE a 1.7%. A cikin PV, tazarar LCOE 1.7% ita ce layin tsakanin umarni ya ci nasara, amfani da ƙarfin aiki, da matakin riba.
Na huɗu: Babban Ciniki, Yankin Tuntuɓar vs Yankin Kariya a kan Seesaw
Ƙirar poly na gida ainihin matsalar seesaw:
Ƙarin ɗaukar poly → mafi kyawun tuntuɓar, ingantaccen jigilar masu ɗauka → amma ƙarin sha mai cutarwa, ƙarancin bifaciality.
Ƙarancin ɗaukar poly → ƙarancin sha mai cutarwa, mafi girman bifaciality → amma mafi girman juriyar tuntuɓar, hana jigilar masu ɗauka.
Takardar ta sami ma'auni tare da tsarin bincike: ɗaukar daga 20% zuwa 100%, auna kariya (J0) da juriyar tuntuɓar (ρc), sannan Quokka 3 yana kwaikwayon inganci a kowane ɗaukar.
Ingantacciyar aiki ta kai kusan kashi 30% na rufewa. A ƙasa da 30%, ƙarancin tuntuɓar yana da nauyi fiye da fa'idar sha; sama da 30%, ƙarancin sha yana da nauyi fiye da fa'idar tuntuɓar.
Layin kwaikwaiyo yana da tsayayyiyar fili mai faɗi a kusan 30%. Canjin rufewa tsakanin 25% da 35% ba zai canza inganci sosai ba. Wannan faɗin taga tsari labari ne mai kyau ga samarwa da yawa.
Aikace-aikacen Samfur
Fassarar Layi: Tebura Biyu Da Zaka Iya Tafiya Da Su
Maɓallin Tsari Na Farko: Buga Farantin Karfe
| Girma | Bayanai | Ma'anar Layi |
|---|---|---|
| Ƙarin inganci | +0.1% cikakken (takarda) | Ƙarin da kake samu kawai daga musanya allo |
| Amfani da azurfa na allo-PI (210R) | 78.5-85.5 mg, matsakaici 83 mg | Bayanan filin Yuni 2026 |
| Ajiyar azurfa na farantin karfe (yatsa na baya) | 3-5 mg/wafer | ~0.047-0.079 yuan/wafer |
| Adadin ajiyar azurfa na shekara (layin 500k/rana) | ~7-12 miliyan yuan/shekara | Fiye da kwanaki 300, manna a 15,779 yuan/kg |
| Fim ɗin allo na PI | 4,000-8,000 yuan, rayuwa 400k | Tushen yanzu |
| Stencil ɗin farantin ƙarfe | 2,000-4,000 yuan, rayuwa ~200k | Sau biyu na canjin lokaci, dole a ƙidaya lokacin dakatarwa |
| Tattalin arziki gabaɗaya | Ajiyar azurfa vs rage darajar allo | Daidaita; layukan da suka cika suna biya, masu ƙarancin aiki su yi hankali |
| Dacewa da babban-sheet-R emitter | Babban riba a 600 Ω/sq | Yi la'akari da inganta emitter a layi daya |
Maɓallin Tsari Na Biyu: Poly-Silicon na Gida
| Girma | Bayanai | Ma'anar Layi |
|---|---|---|
| Ƙarin inganci | ~+0.3% cikakken | Ya fi girma fiye da bugu na farantin ƙarfe |
| Ribar bifaciality | 84% → 90% | Ribar samarwa ta baya 5%+ |
| LCOE reduction | 1.7% | Lissafin tattalin arziki gabaɗaya |
| Sabbin kayan aiki | Picosecond laser + KOH wet etch | Sabbin matakan samarwa |
| Sabon kashe kuɗi a kowace GW | Kimanin yuan miliyan 15-20 (kimin masana'antu, ba a bayyana shi a cikin takarda ba) | Shirin saka hannun jari |
| Yawan amfanin ƙasa | Yanayin dakin gwaje-gwaje >96% | Yana buƙatar tabbatarwa bayan canja wurin zuwa samarwa |
| Daidaitawar layi | Matsakaici (yana ƙara laser + wet etch) | Matsayi mafi girma fiye da buga farantin karfe |
Tuntuɓar da Bayanan kula
Wasu Ƙananan Matsaloli da ya kamata a kula
Na farko, yi lissafin rayuwar farantin karfe a hankali. Rabin farashi, amma rabin rayuwa. Ƙarfin baya yana ceton 3-5 mg a kowace wafer, kusan 0.047-0.079 yuan, wanda ya isa ya rufe gibin amortization. Amma sau biyu na canjin yana kawo lokacin dakatarwa, aiki, da farashin sake daidaitawa wanda zai iya cinye tanadin azurfa akan layin da ba a yi amfani da shi sosai ba. Masana'antun da suka cika aiki suna fara; waɗanda ba su cika ba su yi lissafin kafin su matsa.
Na biyu, sarrafa lalacewar laser akan poly na gida shine babban wahala. Takardar tana amfani da laser picosecond na 532 nm. Yawan kuzari, saurin dubawa, da kuma haɗuwar tabo, duk suna buƙatar daidaitawa don ingancin wafer daban-daban. Takardar ta ce lalacewar laser an "kawar da shi gaba ɗaya" ta hanyar wet etching, amma a wurin samarwa, kwanciyar hankalin kayan aiki, daidaiton abubuwan da ke shigowa, da kuma canjin zafi da danshi na yanayi na iya rage wannan "kawar da shi gaba ɗaya."
Na uku, babu wanda ya tabbatar da yawan amfanin ƙasa bayan haɗa fasahohin biyu. Buga farantin ƙarfe tare da poly na gida tare da high-sheet-resistance emitter, masu canji uku da aka daidaita lokaci ɗaya, kuma taga tsarin yana ƙara ƙunci. An kai 26.09% a ƙarƙashin yanayin dakin gwaje-gwaje mai sarrafawa, kuma yawan amfanin ƙasa na iya sake raguwa idan an kai shi samarwa. Wannan ita ce matsalar gama gari ta kowace sabuwar fasaha da aka gabatar.
Tongwei ya riga ya fara samarwa da yawa, kuma Jietai yana biye da shi. Amma tsakanin "mai iya samarwa da yawa" da "za ka sami kuɗi daga gudanar da shi" akwai cikakken layin iyawar juyawa.
Babban darajar wannan takarda ba shine 26.09% ba, wanda Jinko da Trina za su sake rubuta da sabbin rikodin nan ba da daɗewa ba.
Darajarsa ita ce: Hanyar ci gaban TOPCon na gaba yanzu tana da hanyoyi biyu da aka tabbatar da bayanai. Ɗaya mai sauƙi ne tare da dawowa mai tsayi (bugu na farantin ƙarfe), ɗayan kuma mafi girma ƙofa tare da babban sakamako (poly-silicon na gida). Wanda ka zaɓa ya dogara da wace hanya ce ta fi muhimmanci a gare ka a yanzu.
Ra'ayin Ooitech
Abin da ya fi ba ni mamaki shi ne cewa duka waɗannan hanyoyi biyu sun koma gefen cell, amma matsin ya faɗo a kan layin module na ƙasa. Ƙananan yatsu da mafi girman bifaciality suna canza yadda strings ke aiki yayin tabbing, layup, da lamination, don haka idan kana gina ko haɓaka layin module na TOPCon, tension na stringer, gwajin IV na bifacial, da saitin sun simulator dinka suna buƙatar ci gaba, ba jinkiri ba. Mun ga yawancin masana'antu suna bin rikodin ingancin cell yayin da layin module su ke asarar yawan amfanin ƙasa a hankali a kan sabon geometry. Idan kana son ganin yadda ainihin layin samarwa ke sarrafa waɗannan canje-canje, tashar YouTube ta Ooitech a www.youtube.com/ooitech yana da daraja a bi.
