Dalilin da yasa Sel na Rana na BC ke da Sauƙin Karkata da Lankwasawa

Amsa mai sauri: Kwayoyin da ke da alaƙa da baya sun fi fuskantar lanƙwasa da karkacewa fiye da kwayoyin da ke da alaƙa da gaba saboda duka lambobin polarity suna kan baya, don haka adadin ƙarfe na baya da damuwa da yake haifarwa ba su daidaita da gaba. Lokacin da kwayar ta yi sanyi bayan ƙonewa, ƙarfen baya yana raguwa a kan fuskar gaba marar ƙarfe, kuma sakamakon shine lanƙwasa da za a iya aunawa cikin ɓangarori na millimita a kan kwayar 182 mm ko 105 mm. Yanayin zafin aiki da abin ya shafa — kusan 110 °C a matakai na baya idan aka kwatanta da yanayin yanayi kusan 22 °C — suna ƙayyade nawa bambancin raguwa ke taruwa. Lanƙwasa yana da mahimmanci saboda kwayar da ta karkace ba ta zama a kwance a kan stringer ko a cikin laminate, wanda ke haifar da kurakurai na matsayi, kaurin encapsulant marar daidaito bayan lamination kuma, a mafi munin yanayi, ƙananan tsagewa a haɗin.

PV Module Manufacturing · na Jerry, Ooitech

Lankwasawa da Karkacewar Sel na Hasken Rana na BC

A cikin gasa mai tsanani tsakanin hanyoyin fasahar photovoltaic, sel na hasken rana na BC, ko sel masu haɗin baya, sun yi fice saboda ingantaccen ƙirarsu mai tsabta. Ba tare da layukan grid na ƙarfe a saman gaba ba, sel na BC sun zama ɗaya daga cikin hanyoyin fasaha da masana'antar ke kallo sosai.

Bayan wannan bayyanar mai tsabta, duk da haka, akwai matsala mai wahala ta kera: sel na BC a dabi'ance suna iya lankwasawa da karkacewa.

Kamar yadda ƙwararrun masana'antu suka nuna, duk na'urorin lantarki suna gefen baya, don haka tantanin yana da haɗarin lalacewa ta asali. Yayin haɗa module, ana ci gaba da ƙara kayan a baya, ciki har da mannen rufi, solder ribbons, da manna solder. Yayin da waɗannan yadudduka suke taruwa, matsalar karkacewa na iya ƙara tsananta.

Don haka, me yasa ƙwayoyin BC suka fi sauƙi ga lanƙwasa da warpage fiye da ƙwayoyin hasken rana na al'ada?

1. Rashin daidaituwar tsari yana haifar da haɗarin warpage na asali

Mafi bambancin siffar tantanin BC shine cewa duka na'urorin lantarki masu kyau da marasa kyau suna a saman baya. Babu layukan grid na ƙarfe a gaba. Wannan ƙira yana inganta sha haske, amma kuma yana gabatar da raunin tsari na asali.

Bincike ya nuna cewa Kwayoyin BC suna nuna karkacewa mai yawa fiye da TOPCon Kwayoyin da na'urorin lantarki suka bazu a saman gaba da baya. A ƙarƙashin tsarin baya mai kama, layukan grid na gaba na iya ɗan rage nakasar da ke haifar da raguwa a baya.

Kwayoyin BC ba su da waɗannan layukan grid na gaba. Sakamakon rashin daidaiton damuwa tsakanin saman gaba da na baya yana sa lankwasawa mai siffar silinda ta fi yiwuwa yayin kera da amfani.

Wannan rashin daidaiton tsari shine ainihin sakamakon rashin daidaiton damuwa. Yana kama da yadda sunflower ke lankwasawa zuwa hasken rana saboda bambancin girman girma a bangarorin da ke cikin inuwa da haske. A cikin kwayar BC, damuwar da ke haifar da raguwa daga yawan yadudduka na gefen baya ya fi girma fiye da damuwa a gaba, wanda ke sa wafer ya lankwasa.

2. Rashin Daidaiton Fadada Zafin Jiki Tsakanin Kayan Gefen Baya

Ana buƙatar amfani da yadudduka masu aiki da yawa a gefen baya na kwayar BC. Baya ga na'urorin ƙarfe na al'ada, waɗannan na iya haɗa da kayan rufewa, manna solder, da ribbons na solder. Bambance-bambance a cikin ƙididdigar fadada zafin jiki tsakanin waɗannan kayan shine babban abin da ke haifar da lankwasawa.

• Bambancin fadada tsakanin ƙarfe da silicon yana da mahimmanci musamman. Azurfa tana da ma'aunin faɗaɗa zafi kusan sau bakwai na silicon. A lokacin kera cell, wannan bambanci na iya haifar da matsananciyar damuwa ta thermal tsakanin ƙarfen azurfa da silicon substrate. Warpage na iya zama mafi tsanani bayan an buga solder paste.

• Kayan insulating suma suna taka muhimmiyar rawa. Ana buƙatar insulation don raba electrodes masu kyau da marasa kyau a saman baya, amma ma'aunin faɗaɗa zafi na kayan insulating ya bambanta da na silicon wafer. Idan wurin da insulation ke tuntuɓar cell ya yi girma sosai, amfani da kayan yana ƙaruwa kuma damuwa da ke haifar da rashin daidaiton faɗaɗa zafi shima yana ƙaruwa. Wannan na iya ƙara tsananta warpage na cell kuma ya haifar da haɗari na tsari kamar karyewar cell da cell ɗin mannewa ko haɗuwa yayin sarrafawa.

3. Yin Solder a Gefen Ɗaya Yana Haifar da Rashin Daidaiton Damuwa na Injiniya

BC modules yawanci suna amfani da solder a gefen ɗaya, tare da duk ribbons na solder suna mai da hankali a saman baya. Wannan ya bambanta sosai da yin solder a gefe biyu na al'ada.

Misali, idan an haɗa ribbons na solder guda 21 a kan cell mai girman 182 mm × 105 mm, ana samun warpage mai yawa yayin da zafin jiki ya faɗi daga 110°C zuwa 22°C. Wannan yana faruwa ko da kaurin cell ya kasance 0.13 mm, 0.15 mm, ko 0.18 mm.

Lalacewar ta samo asali ne daga rashin daidaiton thermal stress da ake samu yayin soldering. Matsala ce ta tsari da ke tattare da haɗin gefe ɗaya da ake amfani da shi ga BC cells.

Abin da ya fi damuwa shi ne ƙara kaurin cell ba ya magance matsalar yadda ya kamata. Sakamakon simulation ya nuna cewa soldering na gefe ɗaya na iya haifar da warpage har zuwa 4.9 mm. Ko da an ƙara kaurin cell zuwa 0.18 mm, warpage yana raguwa da kusan 18% kawai. A ƙarƙashin yanayi iri ɗaya, mafi girman warpage da soldering na gefe biyu ke haifarwa shine 0.07 mm kawai.

Wannan yana nufin cewa samun matakin warpage na saldar da aka yi ta gefe biyu ta hanyar ƙara kauri kawai zai buƙaci kauri mai nisa fiye da 0.18 mm. Wannan zai ƙara yawan amfani da silicon da kuma farashin kayan aiki sosai.

Matsalar na iya ci gaba har zuwa lamination. Karkacewar da ba ta daidaita ba sakamakon solder na gefe ɗaya na iya matse encapsulant a kusa da gefuna na tantanin da yankin tsakiya. Mai rufewa na iya zama siriri ko ma a huda shi, yana haifar da wuraren tattara damuwa na gida waɗanda ke barazana ga amincin tsari da amincin module na dogon lokaci.

4. Ƙananan da Manyan Cells Suna Ƙara Matsalar

Masana'antar photovoltaic na ci gaba da neman siraran wafers don rage farashin silicon da manyan nau'ikan sel don ƙara ƙarfin module. Duk waɗannan abubuwan biyu na iya sa BC cell warpage ya yi muni. Bincike ya nuna cewa rage kaurin cell da ƙara girman cell duka suna ƙara haɓakar lalacewa sosai.

Ga cell 210 mm × 210 mm, rage kauri daga 150 μm zuwa 70 μm yana ƙara rahoton warpage daga 1.69 mm zuwa 8.25 mm, kusan haɓaka sau biyar.

Waɗannan alkaluma sun nuna a sarari ƙalubalen da siraran wafer ke haifarwa. Ga masana'antar da ke neman ingantaccen aiki da ƙananan farashi, sarrafa warpage yayin rage kaurin silicon ya zama shingen fasaha wanda dole ne a magance shi.

6. Dabarun Rage Matsala da Hasashen Masana'antu

Masana'antar tana riga tana bincika hanyoyi da yawa don sarrafa BC cell warpage. Hanyoyin gama gari sun haɗa da:

• Ƙirar rabin-cell module: Ƙananan girman sel na iya rage tsayin lankwasawa cikakke.

• Ingantattun kayan layin grid da faɗinsu: Daidaita tsarin ƙarfe na iya taimakawa wajen sarrafa damuwa na gefen baya.

• Saldar ƙarancin zafin jiki: Ƙananan matakan zafin jiki na iya rage damuwa ta zafi yayin haɗin kai.

• Matsa manne mai ɗaukar wutar lantarki: Wannan yana ba da madadin hanyoyin salda na yau da kullun masu zafin jiki.

• Hanyoyin gyara matsi mai lanƙwasa: Za a iya haɗa tsarin gyara na musamman a cikin kayan aikin tabber da stringer don sarrafa siffar sel yayin sarrafawa.

Haɗin Ribbon Salda Ƙarancin Zafin Jiki

Nassoshi

• Dong Peng, Bincike kan Hanyoyin Sel Masu Amfani da N-Type Baya-Tuntuɓi

• MeCan Solar, Halin Lankwasawa da Inganta Tsarin Layin Grid na Manyan Siraran BC Sel

• Binciken Rana da Ajiye Makamashi, Kyawun Kamannin Solder na Gefen Daya Ba Zai Iya Boye Warpage da Hatsarorin da ke Tattare da Shi ba

Ra'ayin Ooitech

Dole ne a kula da sarrafa warpage a matsayin cikakken batun tsari-module, ba kawai matsalar kaurin cell ba. Zazzabin soldering, tsarin ribbon, sarrafa matsi, handling, da lamination dole ne a daidaita su tare, musamman idan ana amfani da siraran cell na BC masu girma. Karamin nakasa da ba a kula da shi ba a matakin haɗin kai na iya zama matsalar samarwa ko aminci daga baya a layin samarwa.