Gabatarwar Samfur

Tsagewar rami na tsakiya shine mafi yawan lahani na gani da ake fuskanta akan layin PV module. Abubuwan da ke haifar da su suna da rikitarwa kuma suna da yawa. Wannan rubutu ya taƙaita abubuwa kuma yana duban tsagewar rami na tsakiya kawai waɗanda ke fitowa daga matsaloli a matakin bussing (overlap soldering). Abubuwa uku na asali, an bi su ɗaya bayan ɗaya.

Ma'aunin Fasaha

Tazarar da aka ajiye tsakanin ribbon da gefen cell ta yi ƙanƙanta

Gefen cell yana kusa da bus bar sosai.

Ƙwayoyin TOPCon suna amfani da tsarin ribbon na gaba mai inganci, kuma an haɗa ribbon ɗin a bayan bus bar. Yayin bussing, injin yana kawo cell da bus bar zuwa wani matakin guda, amma kayan biyu sun bambanta sosai a kauri:

Da zarar ka shiga lamination, wurin da ribbon ya haɗu da gefen cell yana fuskantar ƙarfi biyu.

Lokacin da tazarar tsakanin cell da bus bar ta yi ƙanƙanta, kusurwar tsakanin ribbon da gefen wafer tana raguwa. Ƙarfin ja F1 yana raguwa, kuma matsi na tsaye F2 yana ƙaruwa a lokaci guda.

Wafer suna da rauni. A ƙarƙashin wannan matsi mai girma, gefen yana fashewa cikin sauƙi, kuma za ka ƙare da tsaga a tsakiyar rami.

Fa'idodin Fasaha

Ribbon yana lanƙwasa kuma yana canzawa bayan ƙirƙira

Idan bambancin matakin tsakanin cell da bus bar ya yi yawa yayin bussing, ribbon yana riƙe da bambancin tsayi bayan an haɗa shi.

Bussing ya riga ya gyara jimlar tsawon ribbon. Tsawon da ya wuce ba shi da inda zai shiga, don haka ribbon yana lanƙwasa don ɗauka. Wannan ribbon lanƙwasa yana ci gaba da matsa kan gefen cell, kuma kuna samun tsage-tsage na tsakiya.

Lalacewar zoben solder yayin bussing (wani dalili mai wuya na batch)

Anan cell da bus bar suna da ɗan bambanci a cikin jirgin sama yayin bussing, kuma yankin harpoon ba shi da tallafin bus bar, don haka ribbon ya rabu da wafer. Lokacin da zafin solder ya narke murfin ribbon, zoben solder mai tashe yana kewaye da shi. A lokacin matsi na lamination wannan zoben solder mai wuya yana tura kai tsaye cikin wafer kuma ya tsage shi, yana ba da wani tsage-tsage na tsakiya.

Aikace-aikacen Samfur

Waɗannan hanyoyin gazawa guda uku suna bayyana a yawancin layukan crystalline module, kuma sun fi mahimmanci akan cell masu bakin ciki, masu inganci inda gefen injiniya ya riga ya yi tsauri. Kula da tazarar ribbon-zuwa-cell, daidaita jirgin sama yayin bussing, da sarrafa bayanin solder yana ba ku babban tasiri akan yawan tsage-tsage na tsakiya.

Ra'ayin Ooitech

Wafers na TOPCon na bakin ciki a 0.13mm ba su barin wuri don kuskure, don haka daidaiton ƙarfin F1/F2 da muke magana a kai a nan ainihin matsalar daidaitawa ce da kuke warwarewa a sama a tashoshin stringer da bussing, ba abu ne da za ku iya gyara daga baya a lamination ba. A kan layukan module da muke ginawa, kiyaye cell da bus bar a kan layi ɗaya da riƙe bayanin martabar solder mai tsayi shine inda mafi yawan yawan tsaga-tsaki ke fitowa. Idan kuna son ganin yadda waɗannan matakan ke gudana a masana'anta ta gaske, tashar YouTube ta Ooitech www.youtube.com/ooitech yana da yawan layin layi da ya cancanci kallo.