Me yasa Bussing (Overlap Soldering) ke Haifar da Fasa Tantanin Rana Yayin Lamination a cikin Modules na PV
Teburin Abubuwan Ciki
Gabatarwar Samfur
Tsagewar rami na tsakiya shine mafi yawan lahani na gani da ake fuskanta akan layin PV module. Abubuwan da ke haifar da su suna da rikitarwa kuma suna da yawa. Wannan rubutu ya taƙaita abubuwa kuma yana duban tsagewar rami na tsakiya kawai waɗanda ke fitowa daga matsaloli a matakin bussing (overlap soldering). Abubuwa uku na asali, an bi su ɗaya bayan ɗaya.
Ma'aunin Fasaha
Tazarar da aka ajiye tsakanin ribbon da gefen cell ta yi ƙanƙanta
Gefen cell yana kusa da bus bar sosai.
Ƙwayoyin TOPCon suna amfani da tsarin ribbon na gaba mai kyau, kuma an haɗa ribbon ɗin a bayan bus bar. Yayin bussing, injin yana kawo cell da bus bar zuwa wani matakin guda, amma kayan biyu sun bambanta sosai a kauri:
| Abu | Kauri |
|---|---|
| Standard TOPCon wafer | 0.13mm |
| Bus bar na tsakiya | 0.35mm~0.4mm |
Da zarar ka shiga lamination, wurin da ribbon ya haɗu da gefen cell yana fuskantar ƙarfi biyu.
Lokacin da tazarar tsakanin cell da bus bar ta yi ƙanƙanta, kusurwar tsakanin ribbon da gefen wafer tana raguwa. Ƙarfin ja F1 yana raguwa, kuma matsi na tsaye F2 yana ƙaruwa a lokaci guda.
Wafer suna da rauni. A ƙarƙashin wannan matsi mai girma, gefen yana tsagewa cikin sauƙi, kuma za ka sami tsagewar rami a tsakiya.
Fa'idodin Fasaha
Ribbon yana lanƙwasa kuma yana canzawa bayan ƙirƙira
Idan bambancin matakin tsakanin cell da bus bar ya yi yawa yayin bussing, ribbon yana riƙe da bambancin tsayi bayan an haɗa shi.
Bussing ya riga ya gyara jimlar tsawon ribbon. Tsawon da ya rage ba shi da inda zai je, don haka ribbon yana lanƙwasa don ɗauka. Wannan ribbon lanƙwasa yana ci gaba da matsa kan gefen cell, kuma kuna samun tsage-tsalle na tsakiya.
Lalacewar zoben solder yayin bussing (wani abu mai wuya da ke haifar da tsari)
Anan cell da bus bar suna da ɗan bambanci a cikin jirgin sama yayin bussing, kuma yankin harpoon ba shi da goyon bayan bus bar, don haka ribbon ya rabu da wafer. Lokacin da zafin solder ya narke murfin ribbon, zoben solder mai tashe yana kewaye da shi. A lokacin matsi na lamination wannan zoben solder mai wuya yana tura kai tsaye cikin wafer kuma ya tsage shi, yana ba da wani tsage-tsalle na tsakiya.
Aikace-aikacen Samfur
Waɗannan hanyoyin gazawa guda uku suna bayyana a yawancin layukan crystalline module, kuma sun fi mahimmanci akan cell masu bakin ciki, masu inganci inda gefen injiniya ya riga ya yi tsauri. Kula da tazarar ribbon-zuwa-cell, daidaita jirgin sama yayin bussing, da sarrafa bayanin solder yana ba ku babban damar sarrafa yawan tsage-tsalle na tsakiya.
Ra'ayin Ooitech
Thin TOPCon wafers at 0.13mm leave almost no room for error, so the F1/F2 force balance we talk about here is really an alignment problem you solve upstream at the stringer and bussing stations, not something you can fix later in lamination. On the module lines we build, keeping the cell and bus bar coplanar and holding a steady solder profile is where most center-crack yield actually comes from. If you want to see how these steps run in a real factory, Ooitech's YouTube channel www.youtube.com/ooitech yana da yawan layin layi da ya cancanci kallo.
