Me yasa Fill Factor ke Bayyana Lalacewar Samar da Tantanin Rana Da Farko?
Teburin Abubuwan Ciki
Me yasa Fill Factor ke Bayyana Lalacewar Samar da Tantanin Rana Da Farko?
Gabatarwa: Ma'aunin cika ba siga ce mai keɓe ba. Yana tattara juriya ta lamba, leakage, paste formulation, screen printing, harbi, da taga tsarin LECO a cikin I-V curve guda.
Inganci Yana Nuna Sakamako, Yayin da FF Yake Bayyana Abin Da Ke Faruwa Akan Layin Samarwa
Masana'antar photovoltaic ta faɗaɗa cikin sauri a ƙarƙashin canjin makamashi na duniya. Ƙarfin samar da na'urorin photovoltaic na duniya ya riga ya wuce 200 GW, tare da fitarwa na shekara-shekara yana kan sama da 150 GW. A lokaci guda, fasahar PERC ta shiga matakin ƙarshe na rayuwarta. Ƙarfin canzawa na samarwa da yawa ya tashi zuwa 23.5% kuma yana tafiya da wahala zuwa iyakar ka'idar kusan 24%. Ƙarin riba yana zama da wahala sosai.
Daga mahangar farashin masana'anta, farashin da ba na silicon ba na sel PERC an matse shi zuwa kusan RMB 0.2 a kowace watt, yana barin sarari kaɗan don ƙarin raguwa. Don haka masana'antar ta koma ga fasahohin N-type masu inganci kamar TOPCon, fasahar heterojunction, ko HJT, da sel masu tuntuɓar baya. Manufar ita ce buɗe sabon sararin riba ta hanyar inganci mafi girma da ƙarfin aikin aikin aikin.
Ƙarfin canzawa yana da mahimmanci a fili yayin kimanta tsarar fasahar hasken rana. A kan layin samarwa na gaske, duk da haka, ƙarfin buɗe kewayawa, ko Voc, da ƙarfin gajeren kewayawa, ko Isc, sau da yawa suna daidaita a cikin iyakoki masu kunkuntar. A wannan lokacin, ma'aunin cikawa ya zama alama mai mahimmanci na yawan samarwa na ƙarshe da sigina mai mahimmanci na ƙananan canje-canje na tsari.
A geometri, ma'aunin cikawa yana auna murabba'in layin halayen I-V na tantanin rana. Shi ne rabo tsakanin ainihin murabba'in iyakar ƙarfi da murabba'in ka'idar da Voc da Isc suka kafa. Ƙimar koyaushe tana ƙasa da 1. A ƙarƙashin yanayi masu kyau, iyakar FF na tantanin rana na gallium arsenide na iya kusantar 0.89. Iyakar ka'idar ga tantanin rana na siliki mai ƙarfi na kasuwanci kusan 0.83 zuwa 0.85.
Layin samarwa ba samfuri mai kyau ba ne. Rashin kyakkyawar hulɗar ƙarfe, zubewar da ke da alaƙa da etching, rashin daidaiton manna, ko taga harbi da aka canza duk na iya dagula hulɗar microscopic. Waɗannan lahani suna da matukar damuwa ga tarin zafi. A ƙarshe suna bayyana a matsayin bambance-bambance masu kaifi a cikin juriya mara kyau kuma galibi ana fallasa su ta hanyar raguwar FF.
Ƙididdiga: Alakar Dake Tsakanin Canjin Inganci da FF
η = Pmax / Pin = (Voc × Isc × FF) / Pin
Ma'ana: Lokacin da Voc da Isc suka kasance da kwanciyar hankali, ƙaramin canjin FF yana shiga kai tsaye cikin ingancin canji na ƙarshe.
Ƙididdiga: Ma'anar Ma'aunin Cikawa
FF = Pmax / (Voc × Isc) = (Vmp × Imp) / (Voc × Isc)
Ma'ana: FF yana auna murabba'in I-V curve. A zahiri, yana nuna yadda tantanin halitta yake canza fitarwar wutar lantarki ta ka'ida zuwa ainihin ƙarfin mafi girma.
Jigon Jiki na FF: Jawo Tsakanin Rs da Rsh
Don fahimtar dalilin da yasa FF ke da matukar damuwa ga yanayin masana'anta, dole ne a koma ga samfurin da'irar daidai na tantanin rana. Masu ɗaukar hoto na hasken rana suna yawo da yaduwa ta jikin siliki kafin a tattara su ta hanyar da'irar waje. Asarar makamashi ba makawa ce a wannan tsari.
A matakin lantarki na macroscopic, waɗannan asarar ana wakilta su ta hanyar juriya mara kyau. Manyan sassa biyu sune juriya jerin, Rs, da juriya shunt, Rsh.
Juriya jerin tana wakiltar duk juriya ta jiki ta gaba da ake fuskanta lokacin da wutar lantarki ke gudana zuwa ga nauyin waje. Sakamakon haɗin juriya na jikin siliki, juriya ta hulɗa tsakanin na'urorin gaba da baya da siliki, juriya ta sufuri ta gefen emitter, juriya ta yatsa da busbar, kuma, a matakin module, juriya ta ribbon haɗi.
Daga cikin waɗannan masu ba da gudummawa, juriyar haɗin ƙarfe-semiconductor da bambance-bambance a cikin yawan doping emitter da zurfin junction wasu daga cikin mafi ƙarancin kwanciyar hankali a cikin samarwa da yawa. Su ma suna cikin mafi yawan abubuwan da ke haifar da haɓakar Rs mai kaifi. Juriya ta jeri tana da mummunar alaƙa da ma'aunin cika tantanin halitta.
A kan I-V curve, lokacin da Rs ya ƙaru, gangaren yankin forward-bias kusa da Voc yana raguwa kuma curve ya zama mai laushi. A matakin macroscopic, juriya mafi girma na jeri yana rage iyakar ƙarfin fitarwa kuma yana ja da FF ƙasa.
Juriya ta shunt tana nuna matakin ɗigowar lantarki na ciki. Da kyau, Rsh ya kamata ya kusanci rashin iyaka, ba tare da barin hanyar wucewa ga masu ɗaukar hoto ba. A cikin masana'anta na ainihi, ɗigowar gefe, ɓarnawar crystal, da man ƙarfe da ke shiga cikin PN junction na iya haifar da hanyoyin halitta marasa niyya.
Ƙananan Rsh yana nufin ƙarin ɗigowar lantarki na ciki. Wannan tasirin shunt yana rage halin yanzu da ke wucewa ta cikin PN junction mai aiki kuma yana rage ƙarfin aiki. Matsalar ta zama mafi bayyane a ƙarƙashin ƙarancin haske saboda halin yanzu na hoto ya riga ya yi rauni, yana sa ɗigowa ta zama babban ɓangare na jimlar halin yanzu.
Formula: Ma'aunin Tantanin Rana Tare da Juriya ta Parasitic
I = IL - I0 × { exp[q(V + I×Rs)/(n k T)] - 1 } - (V + I×Rs) / Rsh
Ma'ana: Rs yana hana fitar da halin yanzu, yayin da Rsh ke haifar da hanyar zubewa. Dukansu suna rage FF.
Formula: Yanayin Matsayin Ƙarfin Ƙarfi
d(I×V) / dV = 0
Ma'ana: Matsayin da ƙarfin ya kai mafi girma akan lanƙwasa I-V shine tushen ƙimar Pmax da ake amfani da shi a gwajin samarwa.
Formula: Matsakaicin Juriya na Shunt
RCH = Voc / Isc; rsh = Rsh / RCH
Ma'ana: Daidaitawa tare da juriya na halayen RCH yana ba da damar kwatanta sel na girma daban-daban da nau'ikan halin yanzu akan ma'auni ɗaya.
Formula: Matsakaicin Tasirin Juriya na Shunt akan FF
FFsh ≈ FF0 × (1 - 1 / rsh)
Ma'ana: Ƙananan Rsh, mafi tsananin zubewa kuma mafi girman asarar FF da ke haifarwa.
Wane Matsalolin Samarwa suka dace da Rs da Rsh?
Daga mahangar injiniya, FF yana da mahimmanci ba don kawai yana nuna cewa inganci ya ragu ba. Yana taimaka wa injiniyoyi su gano dalilin da ya sa inganci ya ragu. Juriya na jerin da juriya na shunt suna shafar yankuna daban-daban na I-V curve, don haka suna iya nuna lahani daban-daban na masana'anta.
Formula: Asarar Zafi Sakamakon Juriya na Jerin
Ploss ≈ I² × Rs
Ma'ana: A ƙarƙashin yanayin babban halin yanzu ko babban haske, asarar wutar lantarki da Rs ke haifarwa tana ƙaruwa da murabba'in halin yanzu.
| Yanayin juriya na parasitic | Canji a cikin I-V curve | Tasirin macroscopic | Dalilai masu yiwuwa daga layin samarwa |
|---|---|---|---|
| Juriya na jerin, Rs, yana ƙaruwa | Gangar jikin a yankin gaba-gaba kusa da Voc yana raguwa | FF yana faɗuwa, asarar zafi tana ƙaruwa a ƙarƙashin babban haske, kuma Isc na iya raguwa kaɗan | Rashin kyawun haɗin gaba ko baya, babban juriya na paste, yatsu masu karye, ko rashin isasshen wuta |
| Juriya na shunt, Rsh, yana raguwa | Gangar kusa da Isc da kuma yankin reverse-bias yana ƙaruwa | FF yana faɗuwa, leakage yana rage Voc, kuma aikin low-light yana lalacewa sosai | Rashin cikakken keɓewar gefe, shigar PN-junction ta hanyar wuce gona da iri, lahani na crystal, ko pinholes a cikin fim ɗin passivation |
Mummunar Haɗi: Matsala Mai Tsanani na Metallization
A cikin tsarin aiki daga silicon wafer zuwa cell da aka gama, screen printing da metallization firing matakai ne masu mahimmanci waɗanda ke ƙayyade aikin lantarki. Screen printing ya balaga kuma yana da tsada, amma tsarin haɗin jiki na iya haifar da matsalolin series-resistance da shunt-resistance.
Cells masu inganci na zamani suna amfani da rear dielectric passivation da tsarin local metal-contact don rage yawan surface recombination na rear-side carriers. Saboda dielectric layer mai rufi yana tsakanin karfe da jikin silicon, dole ne a samar da local contact ta hanyar laser opening ko paste-assisted etching. Idan ingancin buɗewa ba shi da kyau ko alloying bai isa ba, karfe da semiconductor ba za su iya samar da ingantaccen ohmic contact ba.
Nazarin sel tare da lambobin sadarwa na gaba da aka buga a fuska ya nuna cewa rashin kyakkyawar hulɗa ya sa juriya ta tashi zuwa 21.34 mΩ. Ƙarfin juyawa ya kai kashi 8.95% kawai, wanda ya yi ƙasa da matakin 17.44% na tantanin aluminum na baya.
Masu binciken sun yi ƙoƙarin dawo da FF ta hanyar daidaita matakin doping na manna aluminum na baya. Yayin da adadin aluminum ya ƙaru, zurfin haɗuwa ya inganta kuma juriya ta ragu. Lokacin da adadin aluminum ya kai matakin mahimmanci na 60%, Rs ya ragu da 11 mΩ idan aka kwatanta da yanayin da ba a yi amfani da shi ba. Wannan ya ɗaga ƙarfin juyawa da kashi 2.59 cikin ɗari.
Da zarar adadin aluminum ya yi yawa, duk da haka, aluminum mai yawa ya rushe hanyar sadarwa a yankin tuntuɓar. Sannan juriya ta sake tashi.
QFLS: Rarraba Lalacewar Kayan aiki daga Lalacewar Masana'antu
Lokacin da layin samarwa ya nuna raguwar FF mai yawa, ɗayan tambayoyin da suka fi wuya shine ko asarar ta fito ne daga sake haɗuwa mara kyau a cikin kayan ko kuma daga juriya mara kyau da aka gabatar yayin bugawa da harbawa.
Rarraba matakin Fermi na Quasi, ko QFLS, kayan aiki ne mai mahimmanci na bincike a wannan yanayin. A cikin ma'anar jiki, QFLS yana ƙayyade iyakar wutar lantarki na na'urar photovoltaic lokacin da babu cire cajin waje. Bambanci tsakanin QFLS da iyakar radiyo yana bayyana asarar sake haɗuwa mara radiyo wanda lahani ko ƙazanta ke haifarwa.
Ta hanyar auna QFLS ta hanyar gani da haɗa shi da nazarin J-V na pseudo mara lamba, masu bincike na iya cire tasirin juriya na jerin daga ma'aunin lantarki na waje.
Idan FF da aka auna ya yi nisa ƙasa da pseudo fill factor da aka samu daga QFLS, asarar yawanci ana iya danganta shi da rashin kyawun haɗin ƙarfe ko yatsotsi. Idan pseudo fill factor ya riga ya yi ƙasa, sake haɗuwa mara radiyo yana iya zama ba a sarrafa shi ba, yana nuna matsala ta asali a cikin ingancin wafer ko kariyar mu'amala.
HJT Low-Temperature Silver Paste: Gina Hanyar Gudanarwa a Ƙasa da 200°C
Yayin da fasahohin N-type ke faɗaɗa, HJT da BC suna sanya ƙarin buƙatu masu tsauri akan ingancin ƙarfe. Don haka FF ya zama muhimmin alama don kimanta sabbin mannoni masu gudanarwa.
Kwayoyin HJT suna amfani da tsarin heterojunction na amorphous-silicon da crystalline-silicon. Wannan yana ba da kariya mai ƙarfi, amma tsarin yana da matukar damuwa ga zafin jiki. Don hana crystallization da lalacewar fina-finan amorphous-silicon, kwayoyin HJT ba za su iya jure yanayin wuta na al'ada sama da 800°C ba. Suna buƙatar manna azurfa mai ƙarancin zafin jiki tare da sarrafa zafin warkewa sosai a ƙasa da 200°C.
Manna azurfa mai ƙarancin zafin jiki yana aiki daban da manna mai zafin jiki na al'ada. Manna azurfa mai zafin jiki yana dogara da narkewar gilashin frit a yanayin zafi mai girma. Gilashin frit yana tsaga ta cikin fim ɗin antireflection kuma yana haɓaka haɓakar crystallites na azurfa zuwa cikin silicon, yana haifar da lamba ohmic mai ƙarancin juriya.
Manna azurfa mai ƙarancin zafin jiki ya dogara da yawancin barbashi na azurfa da aka dakatar a cikin tsarin resin polymer. Bayan ƙafewar sauran ƙarfi a ƙarancin zafin jiki, ana matse barbashin tare don samar da lambobi na lantarki na zahiri.
Wannan tsarin gabaɗaya yana ba wa manna mai ƙarancin zafin jiki mafi girman juriya fiye da manna mai zafi. Yana iya ƙara jimlar juriya na jerin tantanin halitta kuma ya rage FF. Masu samar da manna suna magance matsalar ta hanyar injiniyan ƙura na nanoscale. Matakan yau da kullun sun haɗa da rage yawan azurfa da inganta laushi da rheology na manna don a samar da hanyar sadarwa mai yawa tare da ƙarancin amfani da azurfa.
| Nau'in manna | Yawan azurfa | Yanayin warkewa | Juriya na yawa | Halayen tsari |
|---|---|---|---|---|
| Manna azurfa mai ƙarancin zafin jiki na al'ada | 35%-55%, ko kuma ƙasa da 20%-35% | Saitunan al'ada | Kusan 4-8 μΩ·cm | Laushi na kusan 6-8 μm da danko na kusan 155-165 Pa·s |
| Jerin AP-01, mai ƙunshe da sauran ruwa | 33%-41% | Akalla 120°C na mintuna 6-20 | 4.57-7.62 μΩ·cm | Yana tallafawa bugu mai girman al'amari da layukan sirara sosai |
| Jerin AP-02, mara sauran ruwa | 33%-41% | Aƙalla 110°C na mintuna 5-15 | 4.31-8.53 μΩ·cm | Ya dace da buɗewar allo sama da 15 μm da saurin bugu sama da 400 mm/s |
BC Cells: FF a matsayin Ƙararrawa ga Rashin Nasara na Rarraba Bayan-gida
Idan ƙalubalen HJT shine ƙarancin wutar lantarki a ƙarancin zafin jiki, ƙalubalen ƙwayoyin baya-baya shine iyakokin microscopic na shimfidar lantarki.
BC cells suna kawar da inuwar grid na ƙarfe na gaba kuma suna iya tura Isc sama. Abin da ake samu shine cewa dukkanin lantarki masu kyau da marasa kyau dole ne a jera su a madadin su a tazara kaɗan a saman baya.
A cikin wannan yanki mai yawan wayoyi, ɗan ƙaramin bugu na allo, yada manna, ko ƙaramin lahani na rufin rufi na iya haifar da haɗin jiki tsakanin lantarki masu kyau da marasa kyau. Idan hakan ta faru, Rsh na iya faɗuwa kusan zuwa sifili.
Ƙaramin gajeren kewayawa yana haifar da babban shunt current wanda ke rage wutar lantarki. Voc yana rushewa kuma FF na iya faɗuwa zuwa sifili. Masu samar da haske da aka ƙirƙira kusa da saman gaba dole ne su yi tafiya mai nisa a gefe kafin su isa ga tattara lantarki na ƙarfe na baya. Wannan yana ƙara haɗarin tara juriya na jiki da na gefe.
Saboda wannan dalili, lura da canjin FF yana ɗaya daga cikin mahimman matakan kariyar amfanin gona akan layin samar da sel BC. Kowace sel da ta kasa cika mizanin FF na iya nuna gazawa a keɓewar ƙarfe ko ƙirar jigilar kaya.
Tagan Firing: Duka Underfiring da Overfiring Ana Hukunta su ta FF
Ga sel TOPCon da PERC, firing mai zafi yana ɗaya daga cikin matakai na ƙarshe masu mahimmanci. Silifan silicon da aka buga da na'urorin ƙarfe suna wucewa ta cikin tanderun bel tare da matsakaicin zafin jiki na kusan 800°C. Gilashin frit a cikin mannen ƙarfe yana narkewa ta cikin rufin saman kuma yana samar da haɗin alloy ko kai tsaye tare da silicon ko filin baya. Wannan yana haifar da haɗin ohmic kuma yana rage juriyar jerin.
Tsarin aiki ne mai daidaitawa. Zafin da ya yi ƙasa da ƙasa, ko gudun bel da ya yi yawa, yana haifar da underfiring. Gilashin frit ba zai iya narkewa sosai ba kuma yana iya kasa tsallakewa ta cikin silicon nitride ko tunnel oxide. Ƙananan ƙwayoyin azurfa suna haɗuwa kuma suna shiga cikin silicon. Rufin insulator ya rage tsakanin ƙarfe da semiconductor, yana sa juriyar haɗuwa ta tashi sosai. Gefen forward-bias na I-V curve yana daidaitawa, kuma FF ya zama ƙasa da ƙa'ida.
Matsanancin zafin jiki yana haifar da wuce gona da iri. Man karfe ya zama mai tsauri sosai, kuma lu'ulu'u na azurfa na iya shiga cikin ƙaramin PN junction kamar ƙusoshi. Wannan yana haifar da gajerun hanyoyi da wuraren sake haɗuwa. Kariyar lalacewa, Rsh yana raguwa, kuma zubar da ruwa ya zama matsala mai tsanani.
A cikin binciken EL, lalacewar lattice da gazawar kariya sakamakon wuce gona da iri yakan bayyana kamar alamu na gajimare, alamun ruwa, ko alamun bel na tanderu.
Don faɗaɗa taga tsari, masu samar da kayan aiki sun haɓaka tsarin harbi da allurar haske. Waɗannan tsarin sun haɗa tanderun harbi da ɗakin allurar haske. Bayan annealing mai zafi da alloying, wafer ɗin yana fuskantar haske mai ƙarfi kai tsaye a zazzabi na kusan 150-350°C.
Photons masu ƙarfi suna motsa masu ɗaukar kaya kuma suna canza yanayin cajin atom ɗin hydrogen a cikin wafer da kusa da samansa. Wannan na iya kare lahani na thermal na microscopic da igiyoyin da aka ƙirƙira yayin harbi. Sakamakon gwaji ya nuna cewa wannan magani na iya rage alamun ruwa na EL da alamun bel na tanderu yayin da yake inganta duka Voc da FF.
LECO: Hanyar da ba ta daidaita ba ta hanyar Rikicin TOPCon Metallization
A lokacin fadada TOPCon na farko, haɗin gaba ya zama babban matsalar yawan amfani. Don rage sake haɗuwa a saman, gefen gaba na tantanin TOPCon yana amfani da emitter mai zurfi mai ƙarancin tattarawar doping.
Haɗin zurfi mai zurfi da ƙarancin doping suna haifar da rikici ga manna azurfa mai zafi na al'ada mai ɗauke da gilashin frit. Idan ba a ƙone manna sosai ba, juriyar lamba ta kasance mai girma sosai. Idan an ƙone shi da ƙarfi sosai, haɗin zurfi mai zurfi na iya shiga, yana haifar da zubewa da kuma tura FF zuwa sifili.
Inganta lamba ta Laser, ko LECO, an ƙirƙira shi don magance wannan rikici. LECO yana amfani da tsarin photoelectric mara daidaiton zafi. Maimakon yin amfani da dumama mai zafi mai lalacewa, yana tada masu ɗaukar caji tare da laser mai ƙarfi yayin amfani da juzu'i na kusan 10 V ko sama.
Ƙarƙashin tasirin haɗin gwiwa na ƙarfi da masu ɗaukar hoto, wuraren rauni masu rauni waɗanda ba a haɗa su ta hanyar rashin ƙonewa suna fuskantar fashewar gida. Ana tura masu ɗaukar kyauta ta hanyar lambar ƙarfe-semiconductor ta filin lantarki, suna haifar da igiyoyin gida na amperes da yawa.
Waɗannan igiyoyin ruwa masu ƙarfi suna haifar da zafi na Joule a wuraren tuntuɓar microscopic. Wannan yana haifar da harbin wuta a cikin ƙananan daƙiƙa zuwa micro-daƙiƙa.
LECO yana canza dabarar harbin TOPCon daga dumama duniya mai ƙarfi zuwa gyaran gida da aka yi niyya. Masu samar da paste za su iya tsara tsarin gilashin frit na musamman da ya dace da LECO. Tsarin harbin bel na yau da kullun zai iya kasancewa ba a yi harbi sosai ba don kare emitter mara zurfi, yayin da LECO ke haifar da rushewar lantarki a ƙarshen baya kuma yana rage juriyar tuntuɓar.
Sakamakon tabbatarwa ya nuna cewa sel ba tare da LECO ba na iya aiki kusa da gazawa saboda yawan juriyar tuntuɓar. Bayan maganin LECO, juriyar tuntuɓar tana raguwa yayin da ake kiyaye passivation. FF yana tashi, yana haifar da ribar ingancin canji na cikakken fiye da maki 0.2 bisa ɗari.
LECO har yanzu yana da iyaka na tsari. Idan hasken yayi ƙasa da ƙasa, gyaran tuntuɓar bai cika ba. Idan ya yi yawa, za a iya samun lalacewar lattice da lalacewar tsari.
Lokacin da ƙarfin laser ya kai ƙimar lalacewa ta 375 MW/cm², FF na iya faɗuwa daga 0.84 zuwa 0.65, raguwa kusan 24%. Voc na iya raguwa daga 0.745 V zuwa 0.695 V, yayin da Jsc ke faɗuwa daga 41.8 mA/cm² zuwa 40.8 mA/cm².
Hanyar sadarwa ta microscopic da LECO ta ƙirƙira tana da matakin rashin daidaiton zafi. Binciken EL ya nuna cewa idan tantanin da aka yi wa LECO ya sake yin wani zagaye na zafi mai zafi na biyu, ƙara yawan zafin na biyu daga 280°C zuwa 680°C na iya dagula hanyoyin sadarwa na micro-conductive da aka kafa.
Juriya ta sadarwa sai ta sake yin muni, FF ya ragu sosai, kuma ingancin tantanin farko na 26.35% ya fara raguwa.
FF Ba Kashi Kashi Kawai Ba. Shi Ne Bugun Samun Noma
Duba cikin akwatin baƙi na masana'antar tantanin hasken rana yana bayyana wani abu: fill factor ya fi kashi na abstract da aka nuna akan gwajin dakin gwaje-gwaje.
A matakin microscopic, FF shine bayanin ƙarshe na jawo tsakanin juriya ta jerin da juriya ta shunt tare da hanyar jigilar kaya. A kan layin samarwa, yana rikodin iyakokin conductivity na manna metallization, daidaiton injina na buga allo, da ƙananan canje-canje a cikin yanayin zafi na tanderun harbi.
A cikin sabon zagaye na PV inda farashin da ba na silicon ba ya kusa da ƙasa kuma faɗaɗa jari ya zama mai wahala, kowace babbar fasaha mai inganci tana fuskantar matsala ɗaya.
Dole ne HJT ta kiyaye hanyar sadarwa mai dogaro a cikin iyakar warkarwa mai ƙarancin zafin jiki. Dole ne ƙwayoyin BC su sarrafa zubewa tsakanin ingantattun lantarki masu kyau da marasa kyau waɗanda aka raba da nisa kaɗan kawai. TOPCon ya dogara da harbi, allurar haske, da LECO don gyara lamba yayin kare kariya.
Manufar koyaushe ɗaya ce: rage juriyar haɗin kai ba tare da shiga cikin haɗin PN da haifar da zubewa ba.
Ga masana'antun, neman ƙimar inganci cikakke kadai bai isa ba. Tsarin samarwa mai hankali ya kamata ya lura da ƙananan bambance-bambancen FF a ainihin lokaci kuma ya haɗa su da hanyoyin bincike marasa lalacewa kamar QFLS da nazarin J-V na karya. Wannan ita ce hanya mai amfani zuwa ga ƙirƙira mafi karko na ƙarni na gaba na masana'antar hasken rana mai inganci.
Ra'ayin Ooitech
Ƙimar gaskiya ta FF ita ce saurinta a matsayin ƙararrawar samarwa. Layi mai karko ya kamata ya bi FF tare da Rs, Rsh, tsarin EL, pseudo-FF, zafin harbi, da bayanan ƙarfe maimakon kula da kowane sakamako daban. Ga fasahohin TOPCon, HJT, da BC, wannan tarin bayanai na iya bayyana taga tsari mai canzawa kafin rarraba inganci na ƙarshe ya nuna asarar yawan amfanin ƙasa mai tsanani.
