Silicon wafers masu sirara vs. rayuwar module na shekaru 25-30: Shin duka biyu za su iya wanzuwa?

Gabatarwa

Solar wafers suna kan rage kauri a 2026. Shekaru biyu da suka wuce, kaurin da aka fi amfani da shi ya kasance 150-160μm. Yanzu 120-130μm ya zama ma'aunin samarwa na yau da kullun ga N-type wafers, kuma wasu manyan masana'antu sun tura 110μm zuwa layukan samarwarsu.

Don haka me yasa dukan masana'antar ke gudunmuwa don yin wafers sirara? Da zarar wafers suka ci gaba da sirara, shin cells za su zama masu rauni har su fashe da ɗan taɓawa? Kuma shin modules na ƙasa za su iya ba da shekaru 25, ko ma 30, na tsawon rayuwar ƙira? Waɗannan tambayoyi ne na gaske waɗanda masana'antar da masu saka hannun jari ke damuwa da su.

Me Yasa Dukan Masana'antar Ke Bin Siraran Wafers

Babban abin da ke haifar da siraran wafer shine rage farashi, da kuma adana polysilicon mai daraja.

Kowane yanke 10μm daga kaurin wafer yana rage amfani da silicon a kowace watt da kusan 7%. Bayan cire ƙarin farashin da ba na silicon ba da aka ƙara a matakan yanke da cell, jimlar farashin kowane wafer yana raguwa da kusan 0.03-0.04 yuan. Daga 160μm zuwa 130μm yana adana kusan jiao ɗaya a kowace wafer. A kan shigarwa na shekara-shekara na duniya na 600GW, wannan ya kai dubun-biliyoyin yuan da aka adana a cikin masana'antar kowace shekara.

A yanzu polysilicon yana ɗaukar kashi 9%-14% na jimlar farashin module. Nauyinsa ya yi ƙasa da yadda yake a lokacin hawan polysilicon, amma rage kauri ya kasance hanya mafi inganci don rage amfani da silicon kai tsaye.

Bayan adana kuɗi, wafer masu sirara suna kawo fa'idar lantarki. Mafi siraran wafer, mafi guntuwar hanyar jigilar masu ɗaukar hoto, don haka asarar sake haɗuwa da yawa tana raguwa kuma ingancin cell yana ɗan ƙaruwa. Yana haɗuwa da kyau sosai da TOPCon da HJT.

Amma hanyoyin cell daban-daban suna jure wa rage kauri sosai. HJT tsari ne mai ƙarancin zafin jiki ba tare da matakin doping mai zafi ba, don haka ya dace da wafer masu sirara kuma yana iya zuwa 100-110μm. TOPCon dole ne ya bi ta matakin ajiyar polysilicon mai zafi, kuma wafer masu sirari da yawa suna karkata cikin sauƙi, suna cutar da yawan amfanin ƙasa. Shi ya sa samar da yawan TOPCon galibi yana tsayawa a cikin kewayon 125-135μm.

Yadda ake Kula da Inganci Bayan Sirarwa, da Yadda Moduloli ke Mutunta Garantin Su

Silicon monocrystalline abu ne mai karyewa da yanayi. Yayin da kauri ke raguwa, ikon wafer na jure lankwasawa da damuwa yana raguwa sosai. Ƙwayoyin wafer masu sirara ba za su karye da taɓawa ba, amma yiwuwar ƙananan tsagewa na ƙaruwa a fili. Haɗarin yana ratsa dukan sarkar: yanka, ƙirƙirar ƙwayoyin, tattara moduloli, jigilar kaya, shigarwa a wurin, da kuma aiki na dogon lokaci na masana'anta.

A lokacin yankan wafer da ƙirƙirar ƙwayoyin, wafer masu sirara suna ɗaukar matsi na inji da girgizar zafi cikin sauƙi. Texturing, diffusion, printing da soldering duk na iya barin ƙananan tsagewa waɗanda ido ba zai iya gani ba. Musamman a layukan TOPCon, lankwasawar wafer kai tsaye tana haifar da karyewar sufuri da kurakuran daidaitawa, tana jawo raguwar yawan amfanin dukan layin.

A matakin tattara kayan aiki, matsin lamba da canjin zafin jiki a lokacin lamination suna ƙara ƙarfafa damuwar ciki na wafer kuma suna haifar da ƙananan tsagewa na asali. Kuma duk lahani ba sa bayyana a ƙofar masana'anta. Daga baya girgizar jigilar kaya, bugun da ake yi a wurin aiki yayin gini, sannan kuma canjin zafin jiki na dare da rana da ake yi a kullum bayan tashin injin, suna ci gaba da yin damuwa ta hanyar faɗaɗa da raguwar zafin jiki. Ƙananan tsagewa suna yaɗuwa a hankali. Bayan shekaru biyu ko uku na aiki, wasu ƙananan tsagewa sun zama tsagewa na ɓoye da ake iya gani, suna karya hanyar wutar lantarki ta ciki na tantanin halitta, suna haifar da raguwar ƙarfin wutar lantarki mara kyau, kuma a lokuta masu tsanani suna haifar da haɗarin zafi mai zafi.

Ƙananan wafers da kansu ba sa rage tsawon rayuwar kayan aiki kai tsaye. Abin da ke barazana ga tsawon rayuwar shekaru 25-30 shine lahani na ƙananan tsagewa wanda babu wani bincike da ya gano. Idan dukkan tsarin zai iya kiyaye tsagewa na ɓoye a matakin ƙasa sosai, kayan aikin ƙananan wafer na iya cimma burin tsawon rayuwa. Amma idan sake fasalin tsari a cikin sarkar samarwa ba zai iya ci gaba da saurin rage kauri ba, lahani da aka binne a matakin masana'anta za su bayyana kuma su gaza a tsakiyar zuwa ƙarshen shekarun aikin injin. Rage kauri ainihin ƙarin matsayi ne ga sarkar samarwa wafer-cell-module gaba ɗaya.

Yanke Wafer: Ƙananan Wayar Tungsten Yana Yanke Lalacewar Asali

Masana'antar ta riga ta karɓi wayar tungsten mai ƙarfi mai tsayi sosai, wanda ya maye gurbin wayar diamond na carbon-steel na gargajiya. Layukan siraran wafers na yau da kullun suna amfani da diamita na waya 24μm da ƙasa. Ga wafers masu sirara 110-120μm, ana amfani da wayar tungsten mai sirara 20-22μm. Mafi siraran waya, mafi ƙarancin kerf, mafi ƙarancin lalacewa a saman wafer, kuma mafi ƙarancin ƙananan tsagewa a saman. Wannan yana rage ƙananan tsagewa na asali da wafer ke ɗauka daga masana'anta tun daga tushe.

Ƙirƙirar Cell: Inganta Tsari, Rage Tsagewar Tasiri

Sarrafawa yana mai da hankali kan ƴan matakai masu mahimmanci. Ayyukan rigar suna rage gudun ruwa da motsin kwando don rage buguwa da gogayya. Sufuri yana amfani da hanyoyi masu sassauƙa don rage jan iska da tasirin motsi. Matakan zafi masu girma suna rage saurin haɓaka da sanyaya don hana karkacewa da damuwa na zafi. Buga yana rage matsin squeegee. Sintering yana inganta yanayin yankin zafi don guje wa girgizar zafi-sanyi. Kowane mataki yana haɗe da duban PL don tantance ƙananan tsagewa da wafers marasa kyau da wuri, yana rage karyewa da haɗarin ɓoyayyun tsagewa.

Ƙirƙirar Module: Solder Yana da Muhimmanci, Lamination Yana Bukatar Daidaitawa

Lokacin da ake haɗa sel, yi amfani da dumama mai mataki-mataki kuma ka sarrafa girgizar zafi sosai. Yi amfani da ribbon mai laushi mai kyau don baza damuwa a wurin soldering da rage matsi mai ƙarfi a kan wafers sirara. Daidaita ƙarfin maɓallin latsawa na na'ura don guje wa lalacewa mai ƙarfi ga sel. Zaɓi ribbon mai laushi mai ƙarancin tauri don rage jan hankali tsakanin ribbon da nakasar wafer yayin zagayowar zafi. Bayan soldering, ƙara duban EL don gano ƙananan tsagewa da wuri, don kada su shiga cikin lamination.

A lamination, za ka iya gwada rage saurin vacuum pumping da ƙimar hawan zafi don sassauta girgizar matsi, yayin da ake inganta lanƙwan yankin zafi don guje wa damuwar zafi na ciki daga saurin dumama da sanyaya.

Takaitawa

Sirarar wafer al'ada ce da aka kafa a masana'antu, kuma babu ma'ana a ƙi ta gaba ɗaya. Yayin da dukan sarkar ke amfani da sirara don rage farashi da inganta samarwa, matakan wafer, cell da module dole ne su haɓaka kayan aiki da tsari tare, su sarrafa damuwar injiniya da zafi sosai, su kiyaye daga tsagewa da karyewa, da ƙarfafa duba gaba ɗaya. Wannan shine yadda za ka riƙe layin kan inganci da amincin module na dogon lokaci yayin da har yanzu kana rage farashi.

Ra'ayin Ooitech

Ragewa gaske matsalar sarrafa damuwa ce da ta fi shafar layin samar da kayayyaki, kuma a nan ne zaɓin kayan aiki ke tantance ko waɗancan ƙananan tsagewar da aka binne za su taɓa bayyana. A gefenmu, na'urorin stringer masu ɗauke da segmented gradient soldering da kuma sarrafa soft-ribbon, tare da duban EL kafin lamination, su ne ainihin shingen da ke hana ƙwayoyin 110-130μm su zama gazawar filin bayan shekaru biyar. Kimiyyar siraran wafers an kafa ta, amma yawan amfanin ƙasa ana samun nasara ko asara ne ta yadda layin ku ke sarrafa su cikin sauƙi. Idan kuna son ganin yadda ainihin layin MBB module ke gudanar da waɗannan matakan, tashar YouTube ta Ooitech a www.youtube.com/ooitech tana da daraja a kalla.