Taswirar Fasahar Tantanin BC: Tsari zuwa Aiki
Teburin Abubuwan Ciki
TOPCon, IBC, TBC, HBC da HIBC yawanci ana jera su a matsayin bishiyar dangi na gajarta. An fi karanta su a matsayin jerin matsaloli: kowace hanya tana wanzuwa ne saboda wadda ta gabata ta bar wata asara ta musamman da ba a warware ta ba, kuma kowace tana motsa wahalar zuwa wani wuri.
Fasahar Ƙwayoyin PV · Hanyoyin Tuntuɓar Baya · na Jerry, Ooitech
1. TOPCon: Fara Samun Tuntuɓar Passivation Daidai
TOPCon yana amfani da siririn sirin silicon oxide Layer tare da doped polysilicon Layer don samar da passivation contact. SiOx film yana kula da interface passivation; doped polysilicon yana kula da carrier-selective transport. Kaurin oxide, yawan doping na polysilicon da annealing recipe su ne kullin uku, kuma tare suna rage recombination a contact yayin da suke kiyaye asarar transport da ƙarancin.
Matsalar da ake warwarewa ita ce contact recombination. Metal contact na al'ada da ke taɓa silicon kai tsaye yana haifar da ƙarfin interface recombination. Ta hanyar raba passivation daga carrier selectivity, TOPCon yana kaiwa ga mafi girman open-circuit voltage. Duk da haka, ba ya cire gaban metal grid, don haka gaban-side shading ya rage.
Hoto na 1: Carbon-doped intrinsic polysilicon passivation contact, tare da tsarin a hagu da sakamakon iVoc, J0s da bayanan lifetime a yanayin deposition daban-daban a dama. Aikin da aka buga a 2025 ya sa surface saturation current density ƙasa da 0.5 fA/cm² kuma ya haɗa tsarin da aikace-aikacen back-contact.
2. IBC: Motsa Gaban Metal zuwa Baya
IBC yana yin canji mai tsauri a tsarin: duka lambobin n-type da p-type suna ƙaura zuwa baya. Fuskar gaban tantanin ba ta ɗauke da grid ɗin ƙarfe kwata-kwata, wanda ke ba da damar fuskar gaba don sarrafa gani da ƙirar passivation. Tare da ƙarancin ƙarfe na gaba da ke toshe haske, adadin photon da ke shiga wafer yana ƙaruwa kuma short-circuit current yana da ƙarin damar girma.
Kuɗin yana bayyana a baya. Inda tantanin al'ada ke raba polarities biyu a fuskoki daban-daban, IBC dole ne ya musanya lambobin n-type da p-type a fuska ɗaya, ya kiyaye su a ware ta hanyar lantarki, sannan ya yi metallisation duka biyun. Faɗin lamba, tazarar n/p, iyakar polarity, juriya ta lamba da lissafin grid duk sun zama masu canzawa a haɗe a kan jirgi ɗaya.
Hoto na 2: Haɗin POLO-IBC mai sauƙi. A cikin 2026, tantanin POLO-IBC da aka ƙera a kan wafers masu girman M2 tare da kayan aikin masana'antu sun kai kashi 24.5 cikin ɗari ingantaccen inganci. Binciken asara ya nuna passivation na fuskar gaba, sake haɗuwa a lambar azurfa zuwa yankin n-type polysilicon, da sake haɗuwa da juriya ta lamba a yankin aluminium a matsayin manyan maƙasudai.
3. TBC: TOPCon Ya Shiga Tsarin Back-Contact
TBC shine haɗin guda biyu da suka gabata: TOPCon yana samar da lambar passivation, IBC kuma yana samar da tsarin back-contact. Sakamakon shine nau'in n-type da p-type passivation contacts da aka kafa a baya, tare da gaban da ya kasance ba tare da ƙarfe ba.
Amfanin ya fito ne daga gado. TBC ya ginu ne akan aikin kayan aiki da tsari wanda TOPCon ya riga ya samar da masana'antu. Wahalar da ta rage ta keɓance: lambar passivation ta p-type. Haɗuwar mu'amalarta da halayen lambar suna shiga kai tsaye cikin wutar lantarki ta tantanin halitta da ma'aunin cikawa, wanda hakan ya sa ya zama abin ƙofa maimakon cikakken bayani na ingantawa.
Hoto na 3: Tsarin TBC da zanen band (a, b) tare da taswirorin yuwuwar inganci (c, d). Wani binciken simulation na 2025 kan sigogin na'urar ya kammala cewa TBC yana da yuwuwar inganci kusan kashi 28 da zarar an inganta ingancin wafer, passivation na saman, lambar p-type da tsarin baya tare.
Mafi mahimmancin bincike na TBC game da tsari ne, ba tsarin gini ba. Idan mai ƙera zai iya sake amfani da ingantaccen poly-Si/SiOx passivation stack daga TOPCon kuma kawai ya sake gyara rear patterning da metallisation, nisan da ke tsakanin layin BC da layin TOPCon da ke akwai yana raguwa sosai. Shi ya sa aikin TBC ya ƙaura daga contact stack ɗin kansa zuwa aikin contact, jerin patterning da metallisation.
Hoto na 4: Hanyar ƙarancin farashi ta co-diffusion zuwa TBC precursor, daga samuwar LPCVD i-TOPCon ta hanyar co-diffusion mai matakai biyu, laser isolation, cire rear mask da passivation. Diffusion mai matakai biyu tare da thermal budget guda ɗaya shi ne ke sa adadin matakai da fallasa thermal su kasance masu sauƙin sarrafawa.
4. HBC: Wannan Tunani Daga Bangaren Heterojunction
TBC yana shiga back contact ta hanyar TOPCon. HBC yana shiga ta hanyar silicon heterojunction: SHJ yana samar da passivation contact, IBC yana samar da tsarin back-contact, kuma duka polarities suna ƙarewa a bayan.
SHJ yana samar da lambarsa daga silicon amorphous na asali da kuma wanda aka yi wa doping, wanda ke ba da ingancin passivation mai girma a fuskar saduwa. Haɗe da ribar gaban IBC, HBC yana da ƙarfin wutar lantarki da na yanzu mai ƙarfi. LONGi ya ba da rahoton tantanin HBC na kashi 27.30 cikin ɗari a shekarar 2024, wanda ISFH ta Jamus ta tabbatar.
Hoto na 5: Tarin HBC tare da nuna iyakar polarity (a), da kuma shimfidu biyu na baya tare da yankunan su (b, c). Tazarar da ke tsakanin yankin zaɓin lantarki da yankin zaɓin rami ɗan ƙarami ne, kuma recombination a wurin asarar ce da kanta maimakon sakamako na gefe na heterojunction.
Don haka inganta HBC ba zai iya tsayawa a heterojunction kawai ba. Domin lambobin n-type da p-type suna kusa da juna a baya, iyakar polarity da ke tsakanin su ta zama tushen recombination na musamman wanda ke jan fill factor. Bincike a shekarar 2025 ya yi nazarin wannan iyaka musamman, kuma yana ɗaya daga cikin mafi bayyanannun misalan matsalar BC ta gaba ɗaya: yayin da kake tara ayyuka da yawa a fuska ɗaya, haka ma hulɗar da ke tsakanin su ke ƙara muhimmanci.
5. HIBC: Lambobin Passivation Daban-daban a Tantanin Ɗaya
TBC da HBC kowanne ya himmatu ga tsarin tuntuɓar guda ɗaya. HIBC yana yin wata tambaya daban: idan ma'aunin passivation daban-daban suna da ƙarfi daban-daban, shin za a iya sanya su zuwa yankuna daban-daban na saman baya ɗaya bisa ga abin da kowane yanki ke buƙata?
Amsar da aka buga a Nature a 2025 ita ce i. HIBC yana haɗa tuntuɓar tunnel na polysilicon mai zafin jiki mai girma tare da tuntuɓar heterojunction mai zafin jiki mai ƙasa a saman baya ɗaya, kuma yana amfani da sarrafa laser don ƙarfafa jigilar a cikin tuntuɓar nau'in p a wurin. Sakamakon ya kasance ingancin juyawa kashi 27.81 a kashi 87.55 na fill factor.
Hoto na 6: Sakamakon na'urar HIBC, ciki har da tarin Layer tare da yankin da aka yi wa maganin laser (a), bayanin doping (b), rarraba inganci da fill-factor tare da kuma ba tare da maganin laser ba (c, d), da'irar daidai da kuma yanki na giciye (f), da kuma jerin J-V (g). Lura cewa kalmomin sun canza daga "wane tsari ne zai yi nasara" zuwa "wane yanki ke buƙatar me".
Motsin ra'ayi yana da mahimmanci fiye da lambar. Bayan BC yana ƙunshe da yankuna da yawa na aiki, kuma waɗannan yankuna ba su da buƙatu iri ɗaya don passivation, zaɓin mai ɗauka, juriya ta lamba da ƙarfe. HIBC yana daidaita lambobi bisa ga yanki maimakon amfani da fasahar lamba ɗaya a duk tantanin halitta. Wannan wata falsafar ƙira ce ta daban, kuma ita ce wurin da taswirar hanya ta daina zama tsani.
6. Daga Ƙirƙirar Tsari zuwa Haɗin Kai na Tsari
Sanya hanyoyin biyar a layi ɗaya kuma tsarin ya bayyana: kowane mataki yana magance matsalar sake haɗuwa ko na gani kuma yana ba da mataki na gaba matsalar masana'antu.
| Hanya | Babbar fasaha | Matsalar da aka magance | Mayar da hankali na yanzu |
|---|---|---|---|
| TOPCon | Passivation ta SiOx / poly-Si | Sake haɗuwa a lamba | Ingancin passivation, juriya ta lamba |
| IBC | n da p duka a bayan | Inuwar ƙarfe ta gaba | Tsarin baya, iyakar polarity, ƙarfe |
| TBC | TOPCon + IBC | Sake haɗuwar lamba ba tare da inuwar gaba ba | lamba ta p-type, dacewar tsari da layukan TOPCon |
| HBC | SHJ + IBC | Mafi girman ingancin passivation ba tare da ƙarfe na gaba ba | Haɗuwar iyakar polarity, ƙirar baya |
| HIBC | Haɗin tunnel na Poly-Si + haɗin heterojunction, yanki zuwa yanki | Inganta kowane yanki na baya bisa aikin da yake yi | Ƙarfafa haɗin da laser ke yi na gida, haɗawa |
Yayin da inganci ke ƙaruwa, fuskar baya ke ƙara rikitarwa, kuma taga tsari ke ƙara ƙunci. Lambobin n-type, lambobin p-type, iyakokin polarity, grid ɗin ƙarfe da buɗaɗɗun gida duk dole su kasance cikin iyaka a lokaci ɗaya. Karkatar girma ko jujjuyawar tsari a ɗayansu yana bayyana a matsayin juriyar haɗi, asarar sake haɗuwa ko raguwar tattara wutar lantarki. Wannan shi ne jigon jimlar "daga sabunta tsari zuwa haɗin gwiwar tsari": jagorancin inganci yanzu ya dogara da riƙe matakai da yawa masu alaƙa a tsaye a lokaci ɗaya.
7. Ƙarfe: Inganci da Azurfa Dole A Inganta Su Tare
BC metallisation ba wani nau'i ne da aka haɓaka na bugu na gaba ba. Duk polarities suna a baya, don haka grid ɗin dole ne ya tattara wutar lantarki a cikin wani yanki mai iyaka yayin da yake kiyaye keɓewar lantarki tsakanin yankunan da ke da kishiyar polarity. Faɗin yatsa, tazarar yatsa, busbar, kushin lamba da yankin lamba kowanne yana shafar aiki, kuma suna yin mu'amala.
Hoto na 7: Ma'aunin metallisation na baya don tantanin TBC. Tsarin yatsa, tsarin busbar, busbars masu haɗawa da girman kushin ba zaɓuɓɓuka masu zaman kansu ba ne; kowanne yana musanya juriya ta jerin da daidaiton bugu da amfani da azurfa.
Wani bincike na 2026 kan ƙirar grid na TBC ya yi nazarin waɗannan ma'aunin a tsari kuma ya sanya ingancin tantanin da amfani da man azurfa a cikin tsarin ingantawa guda ɗaya, wanda ya shafi faɗin yatsa, tazarar yatsa, busbar, kushin lamba da shimfidu na busbar sifili. Ƙarshen da ake amfani da shi a aikace shi ne cewa metallisation na BC dole ne a inganta shi a kan gatura huɗu a lokaci ɗaya: juriyar lamba, juriya ta jerin, daidaiton bugu da amfani da azurfa.
Hoto na 8: Inganci a kan amfani da man shafin azurfa don adadin busbar daban-daban da kuma tsarin da ya dogara da pad da kuma tsarin babu busbar (ZBB). Layukan suna yin laushi, wanda ke nufin ƙarin ingancin na ƙarshe yana ƙara tsada a azurfa, kuma zaɓin tsarin yana motsa dukan layin maimakon aya ɗaya a kansa.
A nan ne bincike ya fara kama da saye. Azurfa kuɗi ne mai maimaitawa wanda ke ƙaruwa da yawan samarwa, kuma ƙirar grid da ke saya kashi biyu cikin goma na inganci da babban ƙaruwa a amfani da man shafi wata shawara ce ta kasuwanci daban da wadda ta kai irin wannan ingancin da ƙarancin bugu.
8. IBC Mai Arha: Cire Lithography Daga Tsarin
Rikitarwar masana'antar IBC ta kasance tambaya ta masana'antu ta tsakiya koyaushe. Ƙirƙirar yankuna n-type da p-type masu shiga tsakani a bayan yawanci ya dogara da photolithography da matakan laser, kuma kowane ƙarin mataki yana ƙara kayan aiki, lokacin zagayowar da kuɗi.
Hoto na 9: Hanyoyin IBC guda biyu marasa lithography da aka gina akan shingen yaduwar da aka buga a allo, ta amfani da ko dai mai fitarwa mai iyo na gaba ko filin saman gaba. Dukansu sun dogara da kayan aikin da suka riga suka zama na yau da kullum a layukan sel maimakon sabbin dandamali na tsari.
Wani bincike na 2026 ya nuna cikakkiyar hanyar IBC da aka buga a allo, marar lithography kuma marar laser, ta amfani da shingen yaduwar SiNx mai tsari don cimma zaɓaɓɓen yaduwar boron da phosphorus da kammala sel akan kayan aikin masana'antu da suka balaga, inda aka kai matakin kashi 19 na sel IBC. Adadin kanun labarai da gangan ba shi da ban mamaki. Abin da aikin ya amsa shi ne ko ana iya gina IBC da ƙananan matakan tsari akan kayan aikin da suka riga suka wanzu, kuma wannan tambayar ta fi muhimmanci ga jarin kayan aiki da kuɗin samarwa fiye da wani rikodin dakin gwaje-gwaje.
Idan aka karanta shi tare da aikin ƙarfe, alkibla ɗaya ce: iyakar ba ita ce "shin wannan tsarin zai iya kaiwa kashi 28" ba, amma "shin ana iya samar da wannan tsarin akai-akai, da ƙananan matakai, akan kayan aikin da za a iya yi musu hidima da kuma samar da su a matakin masana'antu".
9. Abin da Wannan Ke Nufi ga Zaɓin Kayan Aiki
Idan ƙullin ya ƙaura daga tsari zuwa tsari na aiki, to shawarwarin kayan aiki da suka fi muhimmanci sun ƙaura tare da shi. Hudu daga cikinsu sun cancanci yin la'akari kafin a ƙayyade layin BC.
| Yanke shawara | Me ya sa ya biyo bayan taswirar hanya |
|---|---|
| Ingancin yanke da gefe | Kowace hanyar BC ta dogara da saman baya inda ayyuka da yawa suke kusa da juna. Ingancin yankan laser da rubutu yana kayyade nawa daga wannan saman za a lalata kafin a samar da kowace lamba. Mu SC-20P BC cell laser cutting machine an ƙayyade shi a kusa da wannan mataki. |
| Soda a fuska ɗaya | A cikin IBC, TBC da HBC duk haɗin gwiwa suna sauka a kan saman ɗaya kusa da sifofin juna biyu, don haka haƙurin sanyawa da sarrafa zafi sun fi muhimmanci fiye da na tantanin al'ada. |
| Zurfin bincike | Rashin iyaka na polarity ko lahani na lamba ba shi da ingantaccen sa hannu na gani. Gwajin EL da IV ta kowace lambar waya na module shine ke juya ɓoyayyen lahani zuwa wanda aka gano, kamar yadda aka bayyana a Gwajin EL: saitin cikin layi da waje. |
| Kasafin matakin aiki | Aikin IBC mai arha ya wanzu ne saboda adadin matakai ke tafiyar da farashi. Kayan aiki da ke haɗa tashoshi ko cire matakin lithography yana canza tattalin arziki fiye da ribar inganci kaɗan. |
Wannan kuma shine dalilin da yasa hanyoyin ba sa gasa don masana'anta ɗaya. TBC ta gaji balagaggen tsarin TOPCon kuma ta dace da masana'antun da ke aiki da layukan poly-Si. HBC ta dace da waɗanda ke da ƙarfin heterojunction. HIBC falsafar ƙira ce ta yanki-yanki maimakon tsarin layi da za ka iya saya a yau. Kuma IBC mai sauƙin sarƙaƙƙiya tana nufin masana'antun da suke son tuntuɓar baya ba tare da gina tsarin lithography ba. Zaɓin ya dogara ne da abin da kake aiki da shi.
Tambayoyi da Amsoshi
Menene bambanci tsakanin IBC, TBC da HBC?
Dukansu uku tsarin tuntuɓar baya ne, ma'ana duka polarities suna a baya kuma gaban ba shi da grid na ƙarfe. Sun bambanta a yadda ake samar da tuntuɓar. IBC ita ce tushen gine-gine. TBC tana samar da tuntuɓar bayanta ta amfani da tuntuɓar passivation na SiOx/poly-Si na TOPCon. HBC tana samar da su ta amfani da tuntuɓar heterojunction na silicon da aka yi daga amorphous silicon na asali da doped.
Menene HIBC?
Hybrid interdigitated back contact. Maimakon amfani da fasahar tuntuɓar guda ɗaya a duk bayan, HIBC tana ba da nau'ikan tuntuɓar daban-daban ga yankuna daban-daban na baya bisa ga abin da kowane yanki ke buƙata, tana haɗa tuntuɓar rami ta polysilicon mai zafin jiki mai girma da tuntuɓar heterojunction mai zafin jiki mai ƙasa da kuma amfani da sarrafa laser don ƙarfafa tuntuɓar nau'in p a wurin. Sakamakon 2025 na Nature ya kasance inganci kashi 27.81 cikin ɗari a ma'aunin cikawa kashi 87.55 cikin ɗari.
Me ya sa iyakar polarity ke zama matsala?
Domin polarities biyu suna zaune kusa da juna a saman guda. Inda yankin zaɓin electron ya haɗu da yankin zaɓin hole, sake haɗuwa a wannan iyaka yana aiki a matsayin ƙarin hanyar asara kuma yana rage ma'aunin cikawa. Sakamako ne kai tsaye na tattara tuntuɓar biyu a fuska ɗaya, kuma shi ne dalilin da ya sa inganta HBC ba zai iya tsayawa a heterojunction kanta ba.
Nawa azurfa ne ƙwayoyin BC ke amfani?
Isasshe har ana ɗaukar ƙirar grid a matsayin matsala ta inganci da amfani maimakon ta lantarki kawai. Nazarin grid na TBC na baya-bayan nan yana inganta faɗin yatsa, tazarar yatsa, busbar da girman pad tare da amfani da man azurfa, kuma ana kimanta shimfidar zero-busbar musamman domin suna canza wannan musanya maimakon kawai tafiya tare da ita.
Za a iya kera IBC ba tare da lithography ba?
Ee, kuma wannan hanya ce mai aiki a bincike. Wani bincike na 2026 ya nuna hanyar IBC da aka buga ta allo gaba ɗaya, ba tare da lithography ko laser ba, ta amfani da shingen yaduwar SiNx mai tsari don zaɓin yaduwar boron da phosphorus, wanda aka gina akan kayan aikin masana'antu da suka balaga kuma ya kai matakin inganci na kashi 19. Manufar aikin ita ce sauƙaƙa tsari maimakon samun inganci mafi girma.
Wace hanya ya kamata sabuwar masana'anta ta tsara?
Fara daga tushen tsarin da kuke da shi a yanzu maimakon daga mafi girman inganci da aka buga. TBC ita ce hanya mafi gajarta ga masana'anta da ke aiki da layukan TOPCon poly-Si, saboda tana sake amfani da wannan rukunin passivation. HBC na buƙatar ƙarfin heterojunction. IBC mai sauƙin tsari ya dace da masana'antun da suke son tuntuɓar baya ba tare da tsarin da ya dogara da lithography ba. Jerin ingancin da aka buga da kuɗin shiga na aiki sun bambanta.
Tunani na Ƙarshe
Hanyoyi biyar ɗin ana fahimtar su mafi kyau a matsayin jerin warware matsaloli guda ɗaya mai ci gaba maimakon samfuran gasa biyar. TOPCon ya warware sake haɗuwar lamba kuma ya bar inuwar gaba a wurin. IBC ya cire ƙarfen gaba kuma ya matsar da wahalar zuwa baya. TBC da HBC kowanne yana ba da wani tsarin lamba daban don wancan baya. HIBC ya daina ɗaukar baya a matsayin saman ɗaya kuma yana daidaita shi yanki-yanki. Abin da dukansu yanzu suka raba shi ne cewa iyaka ba tsarin zanen tsarin ba ne kuma: tattalin arzikin ƙarfe ne, ingancin gefe da iyaka, adadin matakan aiki da ikon riƙe matakai da yawa haɗe-haɗe a tsaye a lokaci ɗaya. Idan kana shirin layin tsarin BC ko TOPCon, gaya mana tsarin tantanin halitta, tsarin lamba da tsarin module da kake nufi, kuma za mu yi aiki kan daidaitawar yankan, ɗaurin igiya da dubawa wanda ya dace da shi.
